A kind of electrophoresis-electrodeposition preparation nano-tio 2 Method for Enhancing SN-Based Microbumps

A technology of electrodeposition and micro-bumps, which is applied in the direction of electrolytic coatings and coatings, to achieve the effects of good bonding, improved reliability of solder joints, and good stability

Active Publication Date: 2020-09-25
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In industry, bumps are prepared by electrodeposition. The composition of bumps is generally Sn-based solder, but nano-TiO is prepared by electrophoresis-electrodeposition. 2 The method of strengthening Sn composite solder has not been reported, and the electrodeposition process is simple, the cost is low, and it can be produced in large quantities

Method used

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  • A kind of electrophoresis-electrodeposition preparation nano-tio <sub>2</sub> Method for Enhancing SN-Based Microbumps
  • A kind of electrophoresis-electrodeposition preparation nano-tio <sub>2</sub> Method for Enhancing SN-Based Microbumps
  • A kind of electrophoresis-electrodeposition preparation nano-tio <sub>2</sub> Method for Enhancing SN-Based Microbumps

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] (1) Select pure copper plate as the metal substrate to be plated, with a purity of ≥99.99%.

[0043] (2) Pre-treatment of the pure copper plate to be plated: the pure copper plate in step (1) is mechanically polished, then ultrasonically cleaned with deionized water, degreased with acetone, cleaned with alcohol, and then dried for use.

[0044] (3) Preparation of electrophoretic solution: 0.048 g magnesium chloride (MgCl 2 ·6H 2 O), 0.02 gCTAB, 0.8 g TiO with a particle size of 20 nm 2 The particles were put into 100 mL of ethanol in turn.

[0045] (4) Ultrasonically disperse the electrophoretic solution in step (3) for 3 h, the ultrasonic power is 150 W, and the ultrasonic frequency is 20-150 kHz, and then magnetically stirred for 1 h at a speed of 1000 r / min.

[0046] (5) The graphite plate is degreased with acetone, cleaned with alcohol, ultrasonically cleaned with deionized water, and then dried for use.

[0047] (6) Pre-treatment of pure copper plate by electro...

Embodiment 2

[0056] Prepare nano-TiO according to the method described in Example 1 2 Reinforce the Sn-based micro-bumps, the difference from Example 1 is that when the electroplating solution is configured, nano-TiO 2 The amount added is 20 g / L.

Embodiment 3

[0058] Prepare nano-TiO according to the method described in Example 1 2 Reinforce the Sn-based micro-bumps, the difference from Example 1 is that when the electroplating solution is configured, nano-TiO 2 The amount added is 30 g / L.

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Abstract

The invention discloses a method for preparing nano TiO2 reinforced Sn-based micro-bumps through electrophoresis-electrodeposition, and belongs to the technical field of electronic packaging. According to the preparation method, the nano TiO2 membrane electrophoresis is carried out by adopting a solution comprising the following components of 0.3-0.6 g / L of magnesium chloride, and 0.1-0.5 g / L of CTAB, 5-50 g / L of nano TiO2 particles; and then electrodeposition micro-bumps is carried out by adopting a solution comprising the following components of 10-60 g / L of stannous sulfate, 0.5-2 mol / L ofconcentrated sulfuric acid, 2-10 g / L of gelatin, 0.1-0.7 mol / L of phenol, 5-50 g / L of nano TiO2 particles, and 0.1-0.5 g / L of CTAB. According to the preparation method disclosed by the invention, thesize of each bump is 20-200 microns, the nano TiO2 particles are uniformly distributed in the bumps, the surfaces of the bumps are flat and the microstructure is compact; and the addition of the nanoTiO2 particles inhibits the growth of Cu6Sn5, intermetallic compound (IMC for short), in the micro-welding spots in the electronic packaging, thereby having a very important significance for improvingthe reliability of the micro-welding spots.

Description

technical field [0001] The invention belongs to the field of electronic packaging, in particular to an electrophoresis-electrodeposition preparation of nano-TiO 2 A method for enhancing Sn-based microbumps. Background technique [0002] In recent years, with the continuous innovation of microelectronics technology, especially the continuous breakthrough of integrated circuit technology, the development of information, communication, energy and other fields has been greatly promoted. As a key technology in the microelectronics industry, electronic packaging has also developed rapidly. At present, electronic packaging technology has realized the functions of chip-to-chip, chip-to-device, device-to-device mechanical connection technology, electrical connection, signal transmission, heat dissipation and cooling. In microelectronic packaging technology, welding is one of the most important technologies. Among them, brazing technology is widely used in electronic packaging becau...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): C25D15/02C25D3/30C25D5/18C25D5/02
CPCC25D3/30C25D5/022C25D5/18C25D15/02
Inventor王燕峰马海涛尚胜艳李傲坤马浩然王云鹏
OwnerDALIAN UNIV OF TECH