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LED (Light Emitting Diode) package structure and preparation method thereof, and LED lamp

A technology of LED packaging and LED chips, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems of cumbersome steps and high cost

Active Publication Date: 2019-04-05
佛山市顺德区蚬华多媒体制品有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Based on this, it is necessary to provide an LED packaging structure and its preparation method, as well as an LED lamp for the problems of cumbersome steps and high cost of the traditional anti-halogenation method.

Method used

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  • LED (Light Emitting Diode) package structure and preparation method thereof, and LED lamp
  • LED (Light Emitting Diode) package structure and preparation method thereof, and LED lamp
  • LED (Light Emitting Diode) package structure and preparation method thereof, and LED lamp

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Embodiment Construction

[0029] In order to make the purpose, technical solution and advantages of the present invention clearer, the LED package structure and its preparation method, and the LED lamp of the present invention will be further described in detail through the following examples and with reference to the accompanying drawings. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0030] see Figure 1-2 , an embodiment of the present invention provides an LED packaging structure, including a cup-shaped bracket, an LED chip 20, an insulating visible light reflective powder layer, and an encapsulant 30. The cup-shaped bracket includes a substrate 12 and a side wall 14, and the side wall 14 and the substrate 12 together form the cavity of the cup-shaped bracket, the insulating visible light reflective powder layer and the LED chip 20 are arranged in the cavity, and the LED chip 20 is fixed on ...

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Abstract

The invention discloses an LED (Light Emitting Diode) package structure. The package structure comprises a cup-shaped bracket, an LED chip, an insulating visible-light reflective powder layer and a package adhesive, wherein the cup-shaped bracket comprises a substrate and sidewalls; a hollow cavity of the cup-shaped bracket is formed by the sidewalls and the substrate; the insulating visible-lightreflective powder layer and the LED chip are disposed in the hollow cavity; the LED chip is fixed on the substrate; the insulating visible-light reflective powder layer covers a region, where the LEDchip is not disposed, on the substrate; the insulating visible light reflective powder layer comprises inorganic oxide-insulated visible light reflective powder; and the package adhesive is filled inthe hollow cavity to cover the LED chip and the insulating visible-light reflective powder layer. The invention further discloses a preparation method of the LED package structure and an LED lamp.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to an LED packaging structure, a preparation method thereof, and an LED lamp. Background technique [0002] Due to its environmental protection, long life, and low energy consumption, LED light sources have attracted much attention, and have been widely used in commercial lighting and home lighting. Common packaging methods for LED light sources include Surface Mounting Device (SMD) and multi-chip integrated packaging (Chip on Board, COB). Due to the reflective requirements on the package substrate, the surface of the package substrate generally has a silver metal layer. However, during the use of LED light sources, the accessories of lamps and the environment may contain sulfur elements, and halogen elements such as sulfur, chlorine, and bromine enter the interior of the light source, and can chemically react with silver metal to form dark substances, resulting in a part of the light ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/60H01L33/56H01L33/54
CPCH01L33/486H01L33/54H01L33/56H01L33/60H01L2933/005
Inventor 邓自然王书方朱俊忠黄宇传苏澄湖
Owner 佛山市顺德区蚬华多媒体制品有限公司