Automatic wafer assembling device and automatic assembling method

Abstract

The invention discloses an automatic wafer assembling device and a wafer automatic assembling method. The wafer automatic assembly device comprises a wafer transmission unit, a rotating disc, a waferconveying unit and a wafer assembly unit, wherein the wafer conveying unit is used for carrying the wafers between a wafer carrying table and the rotating disc; the wafer conveying unit is used for conveying the wafers from a wafer feeding mechanism to a wafer positioning mechanism; the wafer assembly unit comprises a rotating mechanism, a cover opening mechanism, a wafer assembly mechanism and anautomatic screw beating mechanism, wherein the rotating mechanism is used for rotating the rotating disc, the cover opening mechanism is used for opening and closing the wafer cover, the wafer assembly mechanism is used for loading the wafers into the wafer disc and the automatic screw beating mechanism is used for automatically screwing the wafer filled with the wafers. According to the automatic wafer assembling device and the wafer automatic assembling method, the automatic assembly of the wafers can be realized efficiently.

Description

Technical field [0001] The invention relates to the technical field of semiconductor wafer manufacturing, in particular to a wafer automatic assembly device and a wafer automatic assembly method. Background technique [0002] The PSS standard production process of wafers includes the steps of glue coating, exposure, development, ADI inspection, etching, post-etching inspection, stripping, cleaning, final inspection and packaging. Among them, ADI inspection requires the wafer to be placed in the aluminum tray and then transferred to the next process for etching. At present, the inspected wafer is manually placed in the aluminum tray, and the aluminum tray is manually screwed. Due to the high accuracy of the wafer placement position and the prevention of contamination of the wafers, the pass rate of manual operations is low, and the wafer rejection rate is also high, with a rejection rate of about 5%. In addition, even skilled manual operations can only complete about 60 trays a d...

AI Technical Summary

Problems solved by technology

Due to the high precision of wafer placement and the fact that the wafer cannot be contaminated, the qualified rate of manual operation is low, and the wafer scrap rate is also high, and the scrap rate is about 5%.

In addition, even if skilled manual operation can only complete about 60 plates a day, the efficiency is very low

The uneven level of workers' operation and the high turnover of personnel also have a great impact on production

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