Precision Assembly Mechanism

Abstract

The invention discloses a precision assembly mechanism, which includes a control unit, a clamping unit, a bearing unit and a visual sensing unit. The clamping unit has a jaw for clamping the material and can move along a third direction Z, and the bearing unit has a slide rail unit that can be displaced along a first direction X or a second direction Y , so that a material tray is loaded on the slide rail unit, the visual sensing unit has a plurality of sensors, wherein a first sensor is used to identify an upper hole edge position of the material tray perforation, a second The sensor is used to identify the position of the edge of the lower hole perforated by the tray and the position of the needle tip of the material, a third sensor is used to identify the appearance shape of the material in the first direction X, and a fourth sensor is used to identify the material. The appearance shape of the material in the second direction Y, so that the present invention can realize rapid automation and reduce manufacturing costs.

Description

technical field [0001] The invention relates to an inserting device for fine needle materials, in particular to a precision assembly mechanism with fast automatic operation and low manufacturing cost. Background technique [0002] Wafer testing (Wafer Probe) and wafer packaging (Packaging) are the back-end processes of the semiconductor manufacturing process, and wafer testing is to perform needle testing on each die on the chip (chip). The gold wire is made into a hair-thin probe (probe), which is in contact with the pad on the die to test its electrical characteristics. The unqualified die will be eliminated, and the die that has been tested can be tested. The next process is to maintain assembly quality and product yield. Therefore, the wafer test process is an important process that has a great impact on manufacturing costs in integrated circuit manufacturing. [0003] However, with the development of integrated circuits, the technology of packaging and testing has also...

AI Technical Summary

Problems solved by technology

[0003] However, with the development of integrated circuits, the technology of packaging and testing has also been continuously improved. In recent years, the probe specification for wafer testing has also evolved from 150 μm to 24.5 μm, which is thinner than a hair. Reached the limit of manual assembly

[0004] For the alignment of probes, manual insertion is still used in the industry. The staff must clamp the hair-sized probes one by one into the collection tray with a clamp. On average, each staff has to operate hundreds of probes a day. As far as thousands of needles are concerned, it is obvious that relying on manual insertion of needles is not only labor-intensive, but also relatively high in manufacturing costs. In the high-tech industry, it will lead to slow production speed and reduce manufacturing efficiency. Therefore, it is necessary to monitor costs. After consideration, further research and development is required to solve the policy

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