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Superconducting vacuum bridge and preparation method thereof

A superconducting and vacuum technology, applied in the direction of optomechanical equipment, microlithography exposure equipment, manufacturing microstructure devices, etc., can solve problems such as difficult to control the degree of development, inconsistent bridge arch height, cumbersome degumming process, etc., to achieve the goal of process equipment Use and process operation simplification, avoiding the effect of poor consistency control

Active Publication Date: 2019-04-12
UNIV OF SCI & TECH OF CHINA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Use PMGI as the preparation method of sacrificial layer, there are following problems: the first, need to carry out mask exposure and development to photoresist, in actual technology, only developing photoresist and not involving PMGI layer is difficult to control; , it is also necessary to carry out deep ultraviolet exposure and development of PMGI with a developer, and use the developer to remove the photoresist during the development of PMGI; the above process requires two exposures and development of the photoresist and PMGI respectively, At the same time, it also involves deep ultraviolet exposure and mask exposure. The degumming process is cumbersome and it is difficult to control the degree of development. It is easy to cause PMGI to be dissolved by the developer due to improper control of the development time, resulting in inconsistent bridge arch heights; The parameters of developing PMGI and removing photoresist cannot produce vacuum bridges with a length longer than 10 microns, therefore, the preparation method using PMGI as a sacrificial layer is no longer suitable for the preparation of superconducting vacuum bridges

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  • Superconducting vacuum bridge and preparation method thereof
  • Superconducting vacuum bridge and preparation method thereof
  • Superconducting vacuum bridge and preparation method thereof

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Embodiment Construction

[0035] The present disclosure provides a superconducting vacuum bridge and a preparation method thereof. The three-dimensional structure of bridge piers and arches are fabricated by mask exposure on the LOR sacrificial layer and photoresist, and the pattern and location of the superconducting bridge are defined by photolithography. Realize the deposition of superconducting metal on the bridge piers and arches. After removing the sacrificial layer, a superconducting vacuum bridge is obtained; the photoresist is removed by using the difference in solubility of photoresist and LOR in acetone, and before the superconducting metal layer is deposited The oxide film is removed to ensure the superconducting properties, and there is no need for pan-exposure and the process of using developer to remove the photoresist, which essentially prevents the LOR from being dissolved by the solvent during the development process after the pan-exposure, resulting in uniform control of the bridge arch...

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Abstract

The invention discloses a superconducting vacuum bridge and a preparation method thereof. The preparation method comprises: carrying out spinning coating of LOR material on a substrate to use the sameas an LOR sacrificial layer; carrying out spinning coating of first photoresists on the LOR sacrificial layer, and carrying out mask exposure, wherein mask exposure defines positions of bridge piers;carrying out first development, and obtaining a three-dimensional structure of the bridge piers and a bridge arch; utilizing a difference of solubility of the first photoresists and the LOR materialin acetone to remove unexposed photoresists on the bridge arch; carrying out set temperature heating and reflowing on LOR material at the bridge arch to obtain an edge arched bridge arch; sequentiallycarrying out spinning coating of an LOR layer and second photoresists on an edge arched arch bridge; exposing the second photoresists, and carrying out second development; carrying out evaporating coating of a superconducting metal layer; and releasing an LOR sacrificial layer under the superconducting metal layer bridge arch and structures at non-superconducting bridge positions to obtain the superconducting vacuum bridge. The method does not need flood exposure and technology of using a developer to remove photoresists, is simple in technology, and can prepare superconducting vacuum bridgesof more than 10 micrometers.

Description

Technical field [0001] The present disclosure belongs to the technical field of micron superconducting circuit preparation and application, and relates to a superconducting vacuum bridge and a preparation method thereof. Background technique [0002] Air bridge is a kind of circuit structure, it is a way to realize the bridge of planar circuit in three-dimensional bridge. Since air is used as the dielectric between the two conductors, the operating frequency range of the circuit can be expanded. Compared with the current circuit without air bridge, it can realize the connection of the plane waveguide ground wire and cross the plane waveguide, which can enhance the stability of the circuit and construct a complex circuit structure. It is of great significance in micron superconducting microwave circuits. [0003] For superconducting circuits, they generally work in vacuum and at low temperatures, so superconducting vacuum bridges need to be prepared. For superconducting circuits b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00G03F7/20
CPCB81C1/00301G03F7/70383
Inventor 荣皓邓辉龚明吴玉林梁福田廖胜凯彭承志朱晓波潘建伟
Owner UNIV OF SCI & TECH OF CHINA