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Heat dissipation device

A technology of heat dissipation equipment and heat dissipation parts, which is applied in the field of computers and can solve the problems of low heat dissipation efficiency of chips

Active Publication Date: 2019-04-12
WUXI RUIQIN TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The application provides a heat dissipation device and a heat dissipation method, which are used to solve the technical problem of low chip heat dissipation efficiency in the prior art

Method used

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Embodiment Construction

[0031] In order to make the purpose, technical solutions and advantages of the application clearer, the technical solutions in the embodiments of the application will be clearly and completely described below in conjunction with the drawings in the embodiments of the application. Obviously, the described embodiments are only It is a part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application. In the case of no conflict, the embodiments in the present application and the features in the embodiments can be combined arbitrarily with each other. Also, although a logical order is shown in the flowcharts, in some cases the steps shown or described may be performed in an order different from that shown or described herein.

[0032] Optionally, in the embodiment of the present appli...

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Abstract

The present application discloses a heat dissipation device, which is used for solving the technical problem of low heat dissipation efficiency in the prior art. The heat dissipation device includes abase and a heat-dissipating member arranged on the base; the heat-dissipating member includes a first heat-dissipating component and a second heat-dissipating component; the first heat-dissipating component and the second heat-dissipating component are located on opposite ends of the heat-dissipating member, and the heat dissipating capacity of the second heat-dissipating component is greater than that of the first heat-dissipating component.

Description

technical field [0001] The present application relates to the technical field of computers, in particular to a cooling device. Background technique [0002] At present, with the development of electronic technology, the function of the chip is becoming more and more powerful, and the power consumption of the chip is also increasing accordingly, which causes the temperature of the chip to be too high and affects the service life. In the prior art, an air-cooling system is generally used to dissipate heat from the chip, that is, a heat dissipation pipe is provided, and the heat dissipation pipe is in contact with the chip, and the heat generated on the chip is taken away by the flow of air through the metal heat pipe and the fan. [0003] However, the heat dissipation efficiency of the existing method is still low, which cannot meet the requirement of chip heat dissipation. Contents of the invention [0004] The present application provides a heat dissipation device and a h...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/467
CPCH01L23/3672H01L23/467
Inventor 刘韬
Owner WUXI RUIQIN TECH CO LTD