Automatic electroplating production line for circuit boards

Abstract

The invention discloses an automatic electroplating production line for circuit boards, and relates to the field of circuit board production. The automatic electroplating production line for the circuit boards comprises a feeding area, a conveying mechanism, an electroplating mechanism, a discharging area and an electrical control system. The feeding area and the discharging area are separately located on the two sides of the conveying mechanism. The conveying mechanism comprises a driving motor, a driving wheel and a driven wheel. The driving motor drives the driving wheel to rotate. A conveying belt surrounding the driving wheel and the driven wheel is arranged outside the driving wheel and the driven wheel. An Omron PLC is used as the electrical control system. Automatic control software based on a Windows operation system platform is adopted. The circuit boards enter the automatic electroplating production line via the feeding area, then are conveyed to the electroplating mechanism, and are discharged through the discharging area after being electroplated, so that continuous electroplating of the circuit boards is achieved; and meanwhile, the PLC and the automatic control software are used for controlling the conveying speed of the conveying mechanism and realizing automatic accurate control over the electroplating process, and thus, automatic electroplating of the circuitboards is realized.

Description

technical field [0001] The invention relates to the field of circuit board production and manufacturing, in particular to an automatic electroplating production line for circuit boards. Background technique [0002] Electroplating is a process of surface processing of circuit boards by electrolysis. At present, part of the electroplating process of the existing production line for electroplating circuit boards is manually operated, resulting in relatively low electroplating efficiency and poor electroplating quality, which affects the subsequent processing of circuit boards. At the same time, the electroplating of circuit boards requires contact with corrosive acidic solutions, which poses certain hidden dangers to the personal safety of processing operators. Contents of the invention [0003] In order to solve the above problems, the present invention automatically passes the circuit board to be electroplated through the feed area, the electroplating mechanism and the di...

AI Technical Summary

Problems solved by technology

At present, part of the electroplating process of the existing production line for electroplating circuit boards is manually operated, resulting in relatively low electroplating efficiency and poor electroplating quality, which affects the subsequent processing of circuit boards.

At the same time, the electroplating of circuit boards needs to be in contact with corrosive acidic solutions, which poses certain hidden dangers to the personal safety of processing operators.

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