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Thermosetting electrically conductive adhesive

A conductive and thermal curing technology, used in conductive adhesives, adhesives, modified epoxy resin adhesives, etc., to solve problems such as reducing connection resistance

Active Publication Date: 2019-04-19
THREE BOND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the connection resistance value, the invention of Japanese Patent Laid-Open No. 2000-133043 was discovered, but nickel powder was used as an essential component of the conductive particles, and the resistance value of the conductive adhesive tended to increase.

Method used

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  • Thermosetting electrically conductive adhesive
  • Thermosetting electrically conductive adhesive
  • Thermosetting electrically conductive adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～10、 comparative example 1

[0078] In order to prepare the compositions of Examples 1-10 and Comparative Example 1, the following components were prepared.

[0079] (A) Component: curable resin

[0080] ・A urethane-modified oligomer having a (meth)acryloyl group, that is, an aromatic urethane acrylate having 6 functional groups (acryloyl groups) in the molecule (Ebecryl 220 manufactured by Daicel Allnex Co., Ltd.)

[0081] ・2-Hydroxyethyl methacrylate (HEMA Nippon Shokubai Co., Ltd.)

[0082] (B) component: heat curing agent that cures (A) component

[0083] ・Bis(4-tert-butylcyclohexyl)peroxydicarbonate (solid at 25°C) (Peroyl TCP, manufactured by NOF Corporation) (a type of organic peroxide having the structure of the above general formula 2)

[0084] (C) Ingredient: organometallic complex

[0085] ・Zinc acetylacetonate (divalent) (manufactured by NāCEM Zinc Nippon Chemical Industry Co., Ltd.)

[0086] ・Aluminum acetylacetonate (trivalent) (manufactured by Aluminum Nippon Kagaku Sangyo Co., Ltd.)

...

Embodiment 11～14、 comparative example 2～3

[0124] In order to prepare the compositions of Examples 11-14 and Comparative Examples 2-3, the following components were prepared.

[0125] (A) Component: curable resin

[0126] ・3-Ethyl-3phenoxymethyloxetane (Aron Oxetane OXT-211 manufactured by Toagosei Co., Ltd.)

[0127] ・3-Ethyl-3{[(3-ethyloxetan-3-yl)methoxy]methyl}oxetane (AronOxetane OXT-221 manufactured by Toagosei Co., Ltd.)

[0128] ・Multifunctional alicyclic epoxy group-containing silicone oligomer (X-40-2670 Shin-Etsu Chemical Co., Ltd.)

[0129] ・3',4'-Epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate (Ceroxide 2021P manufactured by Daicel Co., Ltd.)

[0130] ・Glycidylamine epoxy resin (EP-3950S manufactured by ADEKA Co., Ltd.)

[0131] ・Bisphenol F type epoxy resin (manufactured by EPICLON EXA-835LV DIC Co., Ltd.)

[0132] ・p-tert-butylphenyl glycidyl ether (manufactured by EPIOL TB NOF Corporation)

[0133] ・Glycidyl neodecanoate (manufactured by CARDURAE10P MOMENTIVE)

[0134] (B) component: heat cu...

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Abstract

In the past, for many types of thermosetting curable resins, it was difficult to achieve an electrically conductive adhesive that would reduce connection resistance when the adherend was nickel, etc.In addition to reducing connection resistance when the adherend is nickel, etc. for many types of thermosetting curable resins, the present invention makes possible an electrically conductive adhesivefor which storage stability is also maintained and which is easy to handle. The present invention is a thermosetting electrically conductive adhesive comprising components (A)-(D): Component (A): curable resin Component (B): thermosetting agent for curing component (A) Component (C): organic metal complex Component (D): electrically conductive particles

Description

technical field [0001] The present invention relates to a thermosetting conductive adhesive having a low connection resistance value. Background technique [0002] Conventionally, it is known that a reducing agent is added to a conductive paste containing copper powder, but the purpose of adding the reducing agent is to prevent oxidation of the copper powder and to suppress a decrease in electrical conductivity. On the other hand, the invention described in JP 2009-70724 A is a conductive paste using copper powder containing a metal complex and a reducing agent. This invention produces fine metal particles by reducing metal complexes, thereby improving electrical conductivity. However, only the conductivity of the coating film itself of the conductive paste is improved, and the influence on adherends such as electrodes has not been considered. [0003] Conductive adhesives are materials that connect two adherends. Therefore, the circuit resistance is composed of the resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J201/00C09J4/02C09J9/02C09J11/04C09J11/06C09J163/00H01B1/00H01B1/20
CPCC08K5/14C09J11/02C08K2201/001H01B1/22C09J9/02C08K9/04C08K2003/0806C08K5/0091C09J11/04C09J11/06C09J163/00C09J201/00H01B1/20C09J163/10
Inventor 太田综一真船仁志加藤诚小玉智也
Owner THREE BOND CO LTD
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