Work holding jig, electronic component processing device, and electronic component manufacturing method
A technology for holding fixtures and electronic components. It is used in capacitor manufacturing, devices that apply liquid to surfaces, and circuits. It can solve problems such as electrode film defects, inability to obtain electrode films, and difficulty in workpiece configuration, and to prevent position shift. or defect effect
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no. 1 approach
[0096] like Figure 1A As shown, the workpiece holding jigs 1A, 1B according to the first embodiment of the present invention include a workpiece holding mechanism 10 and an auxiliary member 20 configured to be detachably attached to the workpiece holding mechanism 10 . In the electronic component processing apparatus, a plurality of workpiece holding jigs 1A, 1B such as Figure 1A Each shown is equipped in a lined state. exist Figure 1A In the shown example, two workpiece holding jigs 1A and 1B are arranged substantially parallel to each other, and one workpiece holding jig 1A is rotated 90° clockwise with respect to the other workpiece holding jig 1B around the Y axis.
[0097] The workpiece holding jigs 1A and 1B are jigs for arranging and holding a plurality of elements of electronic components (hereinafter referred to as workpieces 50 ) in order to form terminal electrodes when manufacturing electronic components. The workpiece holding jigs 1A and 1B are used as auxiliar...
no. 2 approach
[0179] The workpiece holding jigs 1A, 1B according to the present embodiment are the same as the workpiece holding jigs 1A, 1B according to the first embodiment, except that the method of electrode film formation process is different. Hereinafter, the parts different from those of the first embodiment will be described in detail, and the description of the common parts will be omitted. In addition, among components shown in the drawings, common components are assigned common symbols, and a part of the description thereof is omitted.
[0180] like Figure 1D As shown, in the electronic component obtained by performing the electrode film forming process of this embodiment on the workpiece 50A, the electrode film 53A does not have a structure corresponding to the lower surface electrode portion and the Z-axis width of the end surface electrode portion 532A is larger than that of the first embodiment. The end face electrode portion 532 of the second embodiment is different from t...
no. 3 approach
[0192] like Figure 5A and Figure 5B As shown, the workpiece holding jig 201 according to this embodiment is the same as the workpiece holding jig 1A or 1B according to the first embodiment except for the configuration of the workpiece holding mechanism 210 . Hereinafter, the parts different from those of the first embodiment will be described in detail, and the description of the common parts will be omitted. In addition, among the components shown in the drawings, common components are assigned common symbols, and a part of the description thereof is omitted.
[0193] like Figure 5A As shown, a plurality of workpiece storage portions 213 are provided along the Y-axis direction on the upper part in the Z-axis direction of the workpiece holding mechanism 210 of this embodiment.
[0194] The workpiece storage part 213 is comprised by the recessed part 114, and unlike the workpiece storage part 13 of 1st Embodiment, both sides of the X-axis direction of the recessed part 11...
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