Electronic silver paste for ring varistor and preparation method thereof

A piezoresistor and silver paste technology, which is applied in the direction of piezoresistor, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of high price of silver paste products, increase of production cost of manufacturers, Reduce the fluidity of slurry and other problems, achieve the effect of improving market competitiveness and profit margins, preventing the phenomenon of soldering silver corrosion, and improving soldering resistance

Active Publication Date: 2020-07-28
广东羚光新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the average particle size of the silver powder is small, only 0.1-1.0 μm, without increasing the silver content and the thickness of the printed silver layer, after the reduction of the silver paste, the soldering temperature of the silver surface is low (currently the industry generally uses 220-230 ℃ for spot welding), when the temperature exceeds 230 ℃ and the duration exceeds 2 seconds, silver corrosion is very likely to occur during welding, which directly leads to unqualified products, poor solder resistance of silver paste products, and increased production costs
[0005] The electronic paste for annular varistors produced by using spherical ultrafine silver powder has a large specific surface area, which reduces the fluidity of the paste and poor printing performance, which is not conducive to product application.
Or, the ring-shaped varistor silver paste currently used in the industry contains glass powder as a binder phase. The production and processing of glass powder directly increases the cost accounting of silver paste products, and the price of silver paste products is high, which will increase the production of manufacturers. cost

Method used

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  • Electronic silver paste for ring varistor and preparation method thereof
  • Electronic silver paste for ring varistor and preparation method thereof
  • Electronic silver paste for ring varistor and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] In this embodiment, an electronic silver paste for a ring varistor, the electronic silver paste is composed of the following components: 40% ultra-fine silver powder, 30% spherical silver powder, 15% organic carrier, 10% metal oxide, Thinner 5%. in

[0034] The specific surface area of ​​the ultrafine silver powder is 5.0m 2 / g, the particle size is 1.0 μm, and the tap density is 3.0g / mL; the specific surface area of ​​the spherical silver powder is 0.30m 2 / g, the particle size is 2.0μm, and the tap density is 7.0g / mL. like figure 2 as shown, figure 2 It is the electron micrograph of the spherical silver powder used in the present invention;

[0035] The organic vehicle is composed of the following components by weight percentage: 10% ethyl cellulose, 30% diethylene glycol ether, 20% diethylene glycol butyl ether acetate, 15% terpineol, and 10% leveling agent , Butyl Carbitol 15%.

[0036] The metal oxide is composed of the following components in weight perce...

Embodiment 2

[0044] In this embodiment, an electronic silver paste for a ring varistor, the electronic silver paste is composed of the following components: 50% ultra-fine silver powder, 25% spherical silver powder, 12% organic vehicle, 7% metal oxide, Thinner 6%. in

[0045] The specific surface area of ​​the ultrafine silver powder is 8.0m 2 / g, the particle size is 0.8 μm, and the tap density is 2.0g / mL; the specific surface area of ​​the spherical silver powder is 0.40m 2 / g, the particle size is 2.5μm, and the tap density is 6.0g / mL

[0046] The organic vehicle is composed of the following components by weight percentage: ethyl cellulose 15%, diethylene glycol ether 20%, diethylene glycol butyl ether acetate 15%, terpineol 12%, leveling agent 8% , Butyl Carbitol 30%.

[0047] The metal oxide is composed of the following components in weight percentage: 20% of zinc oxide, 40% of bismuth oxide, 15% of aluminum oxide, 10% of iron oxide and 15% of nickel oxide.

[0048] The diluent i...

Embodiment 3

[0055] In this embodiment, an electronic silver paste for a ring varistor, the electronic silver paste is composed of the following components: 45% ultra-fine silver powder, 30% spherical silver powder, 10% organic vehicle, 8% metal oxide, Thinner 7%. in

[0056] The specific surface area of ​​the ultrafine silver powder is 8.0m 2 / g, the particle size is 1.5 μm, and the tap density is 2.8g / mL; the specific surface area of ​​the spherical silver powder is 0.45m 2 / g, the particle size is 2.3μm, and the tap density is 7.0g / mL

[0057] The organic vehicle is composed of the following components by weight percentage: ethyl cellulose 12%, diethylene glycol ethyl ether 18%, diethylene glycol butyl ether acetate 18%, terpineol 12%, leveling agent 5% , Butyl Carbitol 35%.

[0058] The metal oxide is composed of the following components in weight percentage: 25% of zinc oxide, 45% of bismuth oxide, 12% of aluminum oxide, 8% of iron oxide and 10% of nickel oxide.

[0059] Preferab...

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Abstract

The invention relates to electronic silver paste for an annular varistor. The electronic silver paste is composed of the following components: 30-50% of ultrafine silver powder, 20-40% of spherical silver powder, 10-30% of organic carrier, 5.0-15% of metal oxide and 2-10% of thinner. The invention also provides a preparation method of the electronic silver paste for the annular varistor. The preparation method includes mixing the organic carrier and the thinner in a mixer, then adding the metal oxide powder, and finally adding the ultrafine silver powder and the spherical silver powder slowlyinto the mixer to obtain uniform slurry. The electronic silver paste does not contain a glass powder binder phase with the spherical silver powder added, so that the silver paste has good solderability and high solder resistance. The silver paste is relative simple in component and low in cost due to the fact that the glass powder binder phase is not contained.

Description

technical field [0001] The invention relates to the technical field of electronic materials, in particular to an electronic silver paste for a ring piezoresistor and a preparation method thereof. Background technique [0002] The varistor is a resistive device with nonlinear volt-ampere characteristics, which is mainly used for voltage clamping when the circuit is subjected to overvoltage, absorbing excess current to protect sensitive devices. The resistor material of the varistor is a semiconductor, so it is a variety of semiconductor resistors. Now widely used "zinc oxide" (ZnO) varistor, its main material is composed of divalent element zinc (Zn) and hexavalent element oxygen (O). [0003] The ring varistor is a sensitive element with non-linear volt-ampere characteristics, and has the composite function of pressure sensitivity and capacitance. Because the ring varistor has many excellent properties such as small voltage change rate after welding, good pulse resistance,...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00H01C7/10
CPCH01B1/16H01B1/22H01B13/00H01C7/10
Inventor唐国辉万广宇娄红涛丁美蓉宋先刚张旭玲叶志佳
Owner广东羚光新材料股份有限公司