Electronic silver paste for annular varistor and preparation method thereof

A piezoresistor and silver paste technology, which is applied in the direction of piezoresistor, cable/conductor manufacturing, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of high price of silver paste products, increase of production cost of manufacturers, Reduce the fluidity of slurry and other problems, achieve the effect of improving market competitiveness and profit margins, preventing the phenomenon of soldering silver corrosion, and reducing production costs

Active Publication Date: 2019-04-26
广东羚光新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the average particle size of the silver powder is small, only 0.1-1.0 μm, without increasing the silver content and the thickness of the printed silver layer, after the reduction of the silver paste, the soldering temperature of the silver surface is low (currently the industry generally uses 220-230 ℃ for spot welding), when the temperature exceeds 230 ℃ and the duration exceeds 2 seconds, silver corrosion is very likely to occur during welding, which directly leads to unqualified products, poor solder resistance of silver paste products, and increased production costs
[0005] The electronic paste for annular varistors produced by using spherical ultrafine silver powder has a large specific surface area, which reduces the fluidity of the paste and poor printing performance, which is not conducive to product application.
Or, the ring-shaped varistor silver paste currently used in the industry contains glass powder as a binder phase. The production and processing of glass powder directly increases the cost accounting of silver paste products, and the price of silver paste products is high, which will increase the production of manufacturers. cost

Method used

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  • Electronic silver paste for annular varistor and preparation method thereof
  • Electronic silver paste for annular varistor and preparation method thereof
  • Electronic silver paste for annular varistor and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] In this embodiment, an electronic silver paste for ring varistors, the electronic silver paste is composed of the following components: ultrafine silver powder 40%, spherical silver powder 30%, organic carrier 15%, metal oxide 10%, Thinner 5%. among them

[0034] The specific surface area of ​​the superfine silver powder is 5.0m 2 / g, the particle size is 1.0μm, and the tap density is 3.0g / mL; the specific surface area of ​​the spherical silver powder is 0.30m 2 / g, the particle size is 2.0 μm, and the tap density is 7.0 g / mL. Such as figure 2 As shown, figure 2 Is the electron micrograph of the spherical silver powder used in the present invention;

[0035] The organic carrier is composed of the following components by weight percentage: ethyl cellulose 10%, diethylene glycol ethyl ether 30%, diethylene glycol butyl ether acetate 20%, terpineol 15%, and leveling agent 10% , Butyl Carbitol 15%.

[0036] The metal oxide is composed of the following components in weight per...

Embodiment 2

[0044] In this embodiment, an electronic silver paste for ring varistors is composed of the following components: 50% ultrafine silver powder, 25% spherical silver powder, 12% organic carrier, 7% metal oxide, Thinner 6%. among them

[0045] The specific surface area of ​​the superfine silver powder is 8.0m 2 / g, the particle size is 0.8μm, the tap density is 2.0g / mL; the specific surface area of ​​the spherical silver powder is 0.40m 2 / g, particle size is 2.5μm, tap density is 6.0g / mL

[0046] The organic carrier is composed of the following components by weight percentage: 15% ethyl cellulose, 20% diethylene glycol ether, 15% diethylene glycol butyl ether acetate, 12% terpineol, and 8% leveling agent , Butyl Carbitol 30%.

[0047] The metal oxide is composed of the following components by weight percentage: zinc oxide 20%, bismuth oxide 40%, aluminum oxide 15%, iron oxide 10%, and nickel oxide 15%.

[0048] The diluent is composed of the following components in weight percentage, ...

Embodiment 3

[0055] In this embodiment, an electronic silver paste for ring varistors is composed of the following components: ultrafine silver powder 45%, spherical silver powder 30%, organic carrier 10%, metal oxide 8%, Thinner 7%. among them

[0056] The specific surface area of ​​the superfine silver powder is 8.0m 2 / g, the particle size is 1.5μm, the tap density is 2.8g / mL; the specific surface area of ​​the spherical silver powder is 0.45m 2 / g, particle size is 2.3μm, tap density is 7.0g / mL

[0057] The organic carrier is composed of the following components in weight percentage: ethyl cellulose 12%, diethylene glycol ethyl ether 18%, diethylene glycol butyl ether acetate 18%, terpineol 12%, leveling agent 5% , Butyl Carbitol 35%.

[0058] The metal oxide is composed of the following components in weight percentage: 25% zinc oxide, 45% bismuth oxide, 12% aluminum oxide, 8% iron oxide, and 10% nickel oxide.

[0059] Preferably, the diluent is composed of the following components in weight...

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Abstract

The invention relates to electronic silver paste for an annular varistor. The electronic silver paste is composed of the following components: 30-50% of ultrafine silver powder, 20-40% of spherical silver powder, 10-30% of organic carrier, 5.0-15% of metal oxide and 2-10% of thinner. The invention also provides a preparation method of the electronic silver paste for the annular varistor. The preparation method includes mixing the organic carrier and the thinner in a mixer, then adding the metal oxide powder, and finally adding the ultrafine silver powder and the spherical silver powder slowlyinto the mixer to obtain uniform slurry. The electronic silver paste does not contain a glass powder binder phase with the spherical silver powder added, so that the silver paste has good solderability and high solder resistance. The silver paste is relative simple in component and low in cost due to the fact that the glass powder binder phase is not contained.

Description

Technical field [0001] The invention relates to the technical field of electronic materials, in particular to an electronic silver paste for ring varistors and a preparation method thereof. Background technique [0002] Varistor is a resistance device with nonlinear volt-ampere characteristics. It is mainly used for voltage clamping when the circuit is subjected to overvoltage and absorbs excess current to protect sensitive devices. The resistor body material of a varistor is a semiconductor, so it is a variety of semiconductor resistors. Nowadays, the "zinc oxide" (ZnO) varistor is widely used, and its main material is composed of the divalent element zinc (Zn) and the hexavalent element oxygen (O). [0003] The ring varistor is a sensitive element with nonlinear volt-ampere characteristics, and it also has the composite functions of pressure sensitivity and capacitance. Because the ring varistor has many excellent properties such as low voltage change rate after welding, good p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00H01C7/10
CPCH01B1/16H01B1/22H01B13/00H01C7/10
Inventor 唐国辉万广宇娄红涛丁美蓉宋先刚张旭玲叶志佳
Owner 广东羚光新材料股份有限公司
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