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Electrode slurry and preparation method thereof

A technology of electrode paste and glass powder, which is applied in the direction of cable/conductor manufacturing, circuit, and conductive materials dispersed in non-conductive inorganic materials, etc., and can solve problems such as high energy consumption, product microcracks, and appearance defects

Active Publication Date: 2015-04-29
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the sintering temperature of the electrode slurry applied to the copper terminal electrode of MLCC is generally higher than 920°C, and the sintering temperature is relatively high, but at a high sintering temperature, the energy consumption of production is high, which is easy to cause sticking of chips and meshes, etc. Appearance defects, and the internal stress of the product caused by high fever is stronger, and reliability verification is likely to cause microcracks inside the product

Method used

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  • Electrode slurry and preparation method thereof
  • Electrode slurry and preparation method thereof
  • Electrode slurry and preparation method thereof

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preparation example Construction

[0034] The preparation method of above-mentioned electrode slurry, comprises the following steps:

[0035] Step S110, by mass percentage, 10% to 20% of ZnO, 2% to 10% of B 2 o 3 , 15% to 30% SiO 2 , 30%~50% BaO, 2%~10% CaO, 0~10% CuO, 0~10% Al 2 o 3 , 1% ~ 8% Na 2 O, 2% to 8% Nb 2 o 5 Made into glass powder.

[0036] In this embodiment, the above-mentioned components are mixed, melted at high temperature, quenched, ball milled and granulated, dried and sieved to obtain a glass powder with good dispersibility and uniform composition. Of course, other methods in the industry can also be used to prepare glass powder.

[0037] Preferably, the particle size of the prepared glass powder is 1 μm-7 μm.

[0038]Step S120 , adding the polymer resin into an organic solvent heated to 70° C. to 90° C. and dissolving it for 1 hour to 2 hours to obtain an organic binder.

[0039] Preferably, the organic solvent is heated to 70° C. to 90° C. in a water bath.

[0040] Preferably, th...

Embodiment 1～11

[0057] The preparation method of the electrode slurry of embodiment 1~10 is as follows:

[0058] Add the polymer resin into the heated organic solvent and dissolve it for 1 hour to 2 hours to obtain an organic binder; mix the oxides of each component in Table 2 through mixing, high temperature melting, quenching, ball milling, granulation, drying and sieving After treatment, glass powder with good dispersion and uniform particle size of 1 μm to 7 μm is obtained; spherical copper powder, flake copper powder, glass powder, and organic binder are mixed uniformly to obtain a mixture; the mixture is rolled by a three-roll mill The electrode slurry is prepared by grinding to obtain a paste with good dispersibility and certain requirements for fineness, viscosity and rheology.

[0059] The preparation method of the electrode slurry of embodiment 11 is as follows:

[0060] Add the polymer resin into the heated organic solvent and dissolve it for 2 hours to 3 hours to obtain an organi...

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Abstract

The invention relates to electrode slurry and a preparation method thereof. The electrode slurry comprises the following components in percentage by weight: 25% to 75% of spherical copper powder, 0 to 40% of flake copper powder, 3% to 12% of glass powder and 13% to 32% of an organic binding agent, wherein the glass powder belongs to a ZnO-B2O3-SiO2-BaO glass system. The electrode slurry is lead-free, environment-friendly, and lower in sintering temperature.

Description

technical field [0001] The invention relates to an electrode slurry and a preparation method thereof. Background technique [0002] MLCC (Chip Multilayer Ceramic Capacitor) is one of the most used and fastest-growing chip components. It is the most widely used in chip components and is mainly used for oscillation, coupling, In filtering and bypass circuits, the application fields have been expanded to notebook computers, mobile phones, LCD TVs, set-top boxes, digital home appliances, automotive electrical appliances, automatic control instruments and other industries. [0003] The development trend of light, thin, short, and small electronic equipment requires further miniaturization of chip electronic components, and high reliability, high precision, high integration, high frequency, intelligence, low power consumption, large capacity, and low cost are still components technology The main goal of the research. As one of the key materials of MLCC, copper terminal electrode...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B13/00H01G4/30H01G4/232H01G4/248
Inventor 尚小东唐浩宋永生罗文忠吴海斌王文姬
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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