Lead-free soldering-resistant full-silver conductive paste

A technology of silver conductor paste and electronic paste, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, and can solve the problems that are difficult to be used in thick film network exclusion devices.

Active Publication Date: 2010-10-27
GUANGDONG FENGHUA ADVANCED TECH HLDG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current low-cost silver conductor paste is difficult to be used in thick film network exclusion devices

Method used

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  • Lead-free soldering-resistant full-silver conductive paste

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0011] The preparation method of the above-mentioned all-silver electronic slurry includes the preparation process of an organic carrier and the slurry, and the preparation steps of the organic carrier are: A, drying the resin, drying the ethyl cellulose for more than 4 hours, and controlling its moisture content≤0.5 %; B, ingredients, weigh the solvent and polymer resin according to the formula; C, dissolve, put the container containing the solvent into the constant temperature water bath box, stir the solvent at a uniform speed with a dispersing mixer, and add the weighed resin at the same time, after adding the resin , continue to stir and dissolve until a uniform, transparent organic carrier is formed; D, add the organic solvent repeatedly, the amount of which is equivalent to the volatilized organic solvent, E, filter, and remove impurities from the carrier through a nylon filter; F, stand still, let The carrier is cooled and returned to normal temperature, and the cooling...

Embodiment 1

[0014] The lead-free solderable all-silver conductor paste is composed of 80wt% spherical silver powder, 5-12wt% organic solvent, 3-6wt% polymer resin and 1-7wt% lead-free glass powder. The specific surface of the spherical silver powder is 0.1-2.0m 2 / g. The lead-free glass powder is CuO-B 2 o 3 -SiO 2 -Bi 2 o 3 glass system. One or more, or all of the alcohol solvents, ester solvents, and ether solvents commonly used by those skilled in the art are used. The polymer resin is one or more of ethyl cellulose, hydrogenated rosin resin and polyurethane resin. By adopting the preparation method of the all-silver electronic paste of the basic scheme of the present invention, the performance of the all-silver electronic paste prepared is superior, as shown in Table 1. The slurry is applied to the chip network exclusion device, and the relevant electrical properties of the network exclusion device are good, as shown in Table 2.

Embodiment 2

[0016] The lead-free solderable all-silver conductor paste is composed of 81wt% spherical silver powder, 5-12wt% organic solvent, 3-6wt% polymer resin and 1-7wt% lead-free glass powder. The specific surface of the spherical silver powder is 0.1-2.0m 2 / g. The lead-free glass powder is CuO-B 2 o 3 -SiO 2 -Bi 2 o 3 glass system. The organic solvent is one or more, or all, of alcohol solvents, ester solvents, and ether solvents commonly used by those skilled in the art. The polymer resin is one or more of ethyl cellulose, hydrogenated rosin resin and polyurethane resin. By adopting the preparation method of the all-silver electronic paste of the basic scheme of the present invention, the performance of the all-silver electronic paste prepared is superior, as shown in Table 1. The slurry is applied to the chip network exclusion device, and the related electrical properties of the network exclusion device are good, as shown in Table 2.

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Abstract

The invention discloses a lead-free soldering-resistant full-silver conductive paste, comprising the following components by weight percent: 80-85wt% of globular silver powder, 5-12wt% of organic solvent, 3-6wt% of macromolecule resin and 1-7wt% of lead-free glass powder, wherein the appearance of the globular silver powder has the characteristics of high roundness, good dispersibility, moderate contractibility and specific surface of 0.1-2.0m<2> / g; the organic solvent is one or several of alcohol solvents, esters solvents and ethers solvents; the macromolecule resin is one or several of ethocel, hydrogenated rosin resin and polyurethane resin; and the lead-free glass powder is of a CuO-B2O3-SiO2-Bi2O3 glass system. The paste has the advantages of green environmental protection and low cost. The paste can be applied to thick-film network array resistors, with good solderability, soldering resistance, surface compactness and tin coating planeness.

Description

technical field [0001] The invention relates to an electrode slurry for a network exclusion device and a preparation method thereof, in particular to a palladium-free and lead-free all-silver network exclusion device electrode slurry with high silver content and a preparation method thereof. Background technique [0002] The promotion of green and environmentally friendly electronic products is a great progress in the protection of the human environment, but it also brings new issues to the research and development of materials. Conventional technical indicators such as solderability, solder resistance, adhesion, sintering, and appearance will be reduced due to lead-free. Affected, the temperature only needs to be 235°C (the melting point of lead-containing tin is low) when soldering in lead-containing tin. The lead-containing glass in the paste can also effectively protect the silver layer and avoid the phenomenon of "eating silver". After the lead-free process, the soldera...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
Inventor 欧阳铭孟淑媛何建华安艳
Owner GUANGDONG FENGHUA ADVANCED TECH HLDG
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