High-temperature test sorting machine

A technology for testing sorting machines and high temperatures, which is applied in sorting, electrical components, semiconductor/solid-state device manufacturing, etc. It can solve problems such as the inability to test high-temperature state of semiconductor electronic components, and achieve the effects of saving costs and improving production efficiency

Pending Publication Date: 2019-04-26
NORTECH AUTOMATION SHENZHEN CO LTD
View PDF0 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the conventional processing methods for testing, marking and sorting various semiconductor discrete devices can only perform various performance tests at room temperature. Usually, the performance test of semiconductor electro...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-temperature test sorting machine
  • High-temperature test sorting machine
  • High-temperature test sorting machine

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] see Figure 1-14 , in an embodiment of the present invention, a high-temperature test sorting machine discloses a device transmission and testing system composed of multiple sets of advanced DDR motors and real-time control, including a turret pick-and-place module 1, a transfer cooling module Group 2, high temperature pick-and-place module 3, mobile platform module 4, device feeding module 5, correction and test station 6, finished product output modul...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-temperature test sorting machine, which comprises a rotating tower taking and releasing module, a transfer cooling module, a high-temperature taking and releasing module, a mobile platform module, a component feeding module, a correction and test station, a finished product output module and an equipment electrical cabinet, the machine is divided into a component releasing area, a normal temperature testing area, a transfer cooling area, a platform moving area, a high temperature testing area, a cooling testing area, a marking sub-plate area, an appearance testing area, a braided tape output area, and the like, thus semiconductor electronic components are on the same high-temperature test sorting machine, through a mechanical taking and releasing mechanism, the processes of normal temperature electrical test, high temperature electrical test, cooling electrical test, laser marking, appearance test, sorting classification, braid packaging and the like arerealized. By implementing the high-temperature test sorting machine, the functions that originally need multiple test devices to complete are integrated on one device to complete, the production efficiency is improved, and the cost is saved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a high-temperature test sorter. Background technique [0002] Due to the needs of the development of modern society, electronic devices have become more and more complex and can adapt to various environments. This requires electronic components not only to have good performance and reliability, but also to be able to be used normally under various temperature environments. However, the conventional processing methods for testing, marking and sorting various semiconductor discrete devices can only perform various performance tests at room temperature. Usually, the performance test of semiconductor electronic components can only be performed indoors at room temperature. Due to mechanical design , material structure, process technology and other limitations, it is impossible to test semiconductor electronic components in high temperature state. Contents of the invention [0003] The...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): H01L21/67B07C5/34B07C5/344
CPCH01L21/67242H01L21/67271B07C5/34B07C5/344
Inventor 李辉王体李俊强陈俊安
Owner NORTECH AUTOMATION SHENZHEN CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products