High-temperature test sorting machine

Abstract

The invention discloses a high-temperature test sorting machine, which comprises a rotating tower taking and releasing module, a transfer cooling module, a high-temperature taking and releasing module, a mobile platform module, a component feeding module, a correction and test station, a finished product output module and an equipment electrical cabinet, the machine is divided into a component releasing area, a normal temperature testing area, a transfer cooling area, a platform moving area, a high temperature testing area, a cooling testing area, a marking sub-plate area, an appearance testing area, a braided tape output area, and the like, thus semiconductor electronic components are on the same high-temperature test sorting machine, through a mechanical taking and releasing mechanism, the processes of normal temperature electrical test, high temperature electrical test, cooling electrical test, laser marking, appearance test, sorting classification, braid packaging and the like arerealized. By implementing the high-temperature test sorting machine, the functions that originally need multiple test devices to complete are integrated on one device to complete, the production efficiency is improved, and the cost is saved.

Description

technical field [0001] The invention relates to the field of semiconductors, in particular to a high-temperature test sorter. Background technique [0002] Due to the needs of the development of modern society, electronic devices have become more and more complex and can adapt to various environments. This requires electronic components not only to have good performance and reliability, but also to be able to be used normally under various temperature environments. However, the conventional processing methods for testing, marking and sorting various semiconductor discrete devices can only perform various performance tests at room temperature. Usually, the performance test of semiconductor electronic components can only be performed indoors at room temperature. Due to mechanical design , material structure, process technology and other limitations, it is impossible to test semiconductor electronic components in high temperature state. Contents of the invention [0003] The...

AI Technical Summary

Problems solved by technology

However, the conventional processing methods for testing, marking and sorting various semiconductor discrete devices can only perform various performance tests at room temperature. Usually, the performance test of semiconductor electronic components can only be performed indoors at room temperature. Due to mechanical design , material structure, process technology and other limitations, it is impossible to test semiconductor electronic components in high temperature state

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