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Connection structures and circuits

A connection structure and circuit technology, applied in the direction of circuits, printed circuits, circuit devices, etc., can solve problems such as output signal degradation

Active Publication Date: 2021-06-08
NEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] On the other hand, it has been explained that the presence of the stub leads to degradation of a predetermined output signal (see Patent Documents 1 and 2)

Method used

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  • Connection structures and circuits
  • Connection structures and circuits
  • Connection structures and circuits

Examples

Experimental program
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Embodiment Construction

[0036]

[0037] First, the effect of the stub of a pair of vias with a capacitor placed on the output has been examined.

[0038] figure 1 is a conceptual diagram illustrating the configuration of the connection structure 11a used in this study. figure 1 (a) is a top view of the connection structure 11a. figure 1 (b) assumes that the connection structure 11a is figure 1 (a) Cross-sectional view cut by indicated line 291a.

[0039] The connection structure 11a includes a substrate 121a, a capacitor 101a, wirings 132a and 132c, and pads 133a and 133c.

[0040] The substrate 121a includes wirings 131a and 131b and through holes 111a and 111b. The thickness of the substrate 121a is the length 191a.

[0041] The through holes 111a and 111b are disposed in the substrate 121a in a manner of penetrating the substrate 121a. will refer to later figure 2 Details of the through holes 111a and 111b are described.

[0042] The wirings 131a and 131b are general wirings formed insi...

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Abstract

The present invention solves the problem of providing a connection structure or the like capable of minimizing the reduction of the routable area of ​​the substrate while reducing the effect of a stub of a pair of vias on the output of a capacitor connected to said vias . In order to solve this problem, the connection structure includes: a first conductor passing through the substrate and having a first input / output portion; a second conductor passing through the substrate and having a second input / output portion; a first capacitor having One terminal is connected to the terminal of the first conductor located on the first surface of the substrate, the other terminal of which is connected to the terminal of the second conductor located on the first surface of the substrate; and a second capacitor or resistor, one of which The terminal is connected to the terminal of the first conductor on the second surface of the substrate, the other terminal of which is not connected to one terminal of the terminal connected to the second conductor on the second surface, wherein the first input / output part is provided to a part of the side of the first conductor, and / or the second input / output is provided to a part of the side of the second conductor.

Description

technical field [0001] The present invention relates to a connection structure between a plurality of via holes. Background technique [0002] In order to bring the output of a certain circuit into an AC-coupled state with the input of another circuit, a capacitor is usually inserted between the output and the input. Here, AC is an abbreviation for Alternating Current. [0003] When such a capacitor is mounted between a pair of via holes (hereinafter, referred to as “via holes”) disposed in a substrate, the capacitor is connected between terminals of the pair of via holes exposed on one surface of the substrate. Then, the wiring incorporated in the substrate is electrically connected to a part of the side of the via hole. Therefore, there will be a stub in the via hole as a portion through which current does not flow (see Patent Documents 1 and 2). [0004] On the other hand, it has been explained that the presence of the stub leads to degradation of a predetermined outpu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46
CPCH05K2201/10015H05K2201/10545H05K2201/10636H05K1/181H05K1/114H05K3/429H05K1/0251H05K1/0239Y02P70/50H01L23/5226H01L23/5223H05K3/46H05K3/00
Inventor 上村文子柏仓和弘
Owner NEC CORP
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