Decoupled dual-mass silicon micromachined vibrating gyroscope structure

Abstract

The invention discloses a decoupling double-mass silicon micromechanical vibration gyroscope structure, which is used to measure an angular rate measuring instrument perpendicular to the base level, and is composed of an upper layer of single crystal silicon, a middle layer of single crystal silicon, and a lower layer of single crystal silicon , the upper layer of single crystal silicon is a silicon micro-gyroscope packaging cover plate with signal input / output leads, the middle layer of single crystal silicon wafer is made of gyroscope mechanical structure, and the lower layer of single crystal silicon is a gyroscope with a fixed base The instrument substrate, the middle layer of single crystal silicon is sealed in the airtight cavity formed by the upper layer of single crystal silicon and the lower layer of single crystal silicon. The invention has small mechanical coupling error, high mechanical sensitivity, low vibration sensitivity and low temperature sensitivity, and can realize the motion decoupling of the driving structure and the detection structure, and the decoupling of large amplitude vibration and detection output.

Description

technical field [0001] The invention belongs to micro-electro-mechanical systems and micro-inertial measurement technology, in particular to a decoupling double-mass silicon micro-mechanical vibration gyroscope structure. Background technique [0002] Silicon micromachined gyro is an inertial sensor for measuring the rotational angular rate. It adopts micromachining technology to realize structural processing, and can be fully integrated with its measurement and control circuit on a silicon chip, so it has small size, low cost, light weight and reliability. It has high advantages and has important application value in the field of military and civilian dual-use. [0003] At present, the performance of my country's silicon micromachined gyroscopes in the laboratory environment has developed from the ordinary vehicle level to the level close to the tactical level (1° / h). The two key issues to be solved for the silicon micromachined gyroscope to move from the laboratory to the...

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Problems solved by technology

In fact, the relative error of the MEMS process is about 2 to 3 orders of magnitude compared with the traditional manufacturing process. The processing error causes the structure to be asymmetrical, and there is still a large coupling effect between the driving structure and the detection structure of the decoupled dual-mass gyroscope.

Especially for the scattered layout of the driving structure, firstly, the large gap error of the comb tooth caused by etching will generate a large non-ideal force on the driving comb tooth, resulting in a large quadrature coupling error and in-phase coupling error; When the temperature changes, the deformation of the fixed electrode of the driving comb teeth is large, and the temperature coefficient of the quadrature coupling error and the in-phase coupling error is large, and the temperature performance of the gyroscope is poor.

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