Manufacturing process used for producing PCB boards by using horizontal tin deposition

A technology of PCB board and manufacturing process, which is applied in the field of manufacturing process of PCB board using horizontal immersion tin, which can solve the problems that are not easy to fade and affect the quality of PCB board, so as to reduce ionic pollutants, improve the quality of PCB board production, and step by step Clear and Easy Effects

Inactive Publication Date: 2019-05-17
江门荣信电路板有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, most factories use vertical immersion tin production lines, which are easy to produce liquid stains when changing cylinders. Because they remain on the cylinders, they are not easy to fade away, so the quality of PCB boards will be affected when immersion tin is performed on PCB boards.

Method used

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  • Manufacturing process used for producing PCB boards by using horizontal tin deposition

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Embodiment Construction

[0024] refer to figure 1 , the embodiment of the present invention provides a kind of manufacturing process that utilizes level immersion tin to produce PCB board, comprises, executes manufacturing process: make PCB board pass through each tin cylinder that is arranged horizontally; When executing manufacturing process, perform the following steps:

[0025] UV curing treatment on PCB board;

[0026] Perform pre-soaking treatment on each tin cylinder;

[0027] Immersion tin surface treatment on the PCB board.

[0028] In this embodiment, UV curing is ultraviolet curing, wherein UV is the English abbreviation of ultraviolet light, curing refers to the process of converting a substance from a low molecular weight to a high molecular weight, and UV curing generally refers to coatings (paints) and inks that need to be cured by ultraviolet rays. , Adhesive (glue) or other curing conditions or requirements for potting and sealing agents; use horizontally set tin tanks to sink tin, ...

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Abstract

The present invention discloses a manufacturing process used for producing PCB boards by using horizontal tin deposition. A PCB board is allowed to pass through all tin cylinders arranged horizontally. The manufacturing process comprises the following steps: performing the UV curing process on the PCB board; performing the pre-immersion process on all the tin cylinders; and performing the tin deposition surface process on the PCB board. According to the manufacturing process, compared with the prior art, the steps of the manufacturing process are clear and simple; by processing on the PCB board and the tin cylinders, the standard and stable PCB board can be obtained; and the tin deposition is performed by adopting horizontally arranged tin cylinders, so that the manufacturing process can facilitate to improve the production quality of the PCB board.

Description

technical field [0001] The invention relates to the field of PCB manufacturing, in particular to a manufacturing process for producing PCB boards by using horizontal immersion tin. Background technique [0002] Immersion tin is an important surface treatment process for circuit boards and plays an irreplaceable role in the field of PCB board production. At present, most factories use vertical immersion tin production lines, which are easy to produce liquid stains when changing cylinders. Because they remain on the cylinders and are not easy to fade, the quality of PCB boards will be affected when immersion tin is performed on PCB boards. Contents of the invention [0003] In order to solve the above problems, the object of the present invention is to provide a manufacturing process for producing PCB boards by using horizontal immersion tin. The use of horizontally arranged tin cylinders for immersion tin can prevent the occurrence of liquid marks when changing cylinders, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/18
Inventor 曾建华
Owner 江门荣信电路板有限公司
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