Unlock instant, AI-driven research and patent intelligence for your innovation.

Heat dissipation module

A technology of heat dissipation module and heat dissipation fins, applied in indirect heat exchangers, heat exchange equipment, heat exchanger types, etc., can solve the problems of difficult design of heat dissipation mechanism and difficult to overcome heat dissipation problems.

Pending Publication Date: 2019-05-21
CORETRONIC
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, the shrinking size of electronic products will make the design of heat dissipation mechanism more difficult, making the heat dissipation problem more difficult to overcome

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat dissipation module
  • Heat dissipation module
  • Heat dissipation module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as: up, down, left, right, front or back, etc., are only referring to the directions of the drawings. Accordingly, the directional terms are used to illustrate and not to limit the invention.

[0023] figure 1 is a three-dimensional schematic diagram of a heat dissipation module according to an embodiment of the present invention, and figure 2 Yes figure 1 A schematic cross-sectional view of the heat dissipation module perpendicular to the extending direction of the heat pipe. Please refer to figure 1 and figure 2 , the heat dissipation module 100 of this embodiment includes a plurality of heat dissipation fins 110 and a plurality of heat pipes 120 . The heat dissipation...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention discloses a heat dissipation module. The heat dissipation module comprises a plurality of cooling fins and a plurality of heat pipes. The cooling fins are mutually spaced apart and arranged side by side, and a gas flow channel is formed between each two adjacent cooling fins. Each gas flow channel has an inlet end and an outlet end which are opposite. Each heat pipe penetrates and is connected with the cooling fins in an extension direction, and the heat pipes are mutually spaced apart. In the cross section, perpendicular to the extension direction, of each heat pipe, themaximum length of each cross section in a first length direction is L1, and the maximum length of each cross section in a second length direction is L2, wherein the first length direction faces the outlet ends from the inlet ends, the second length direction is perpendicular to the first length direction, and L1>L2. The present invention further provides a heat dissipation module for a projectiondevice. The heat dissipation module is used for improving heat dissipation efficiency.

Description

technical field [0001] The present invention relates to a heat dissipation module, and in particular to a heat dissipation module applicable to a projection device. Background technique [0002] Most of today's electronic products pursue high performance and small size. In order to improve performance, components in electronic products tend to generate more heat energy, which leads to heat dissipation problems. In addition, the shrinking size of electronic products will make the design of heat dissipation mechanism more difficult, making the heat dissipation problem more difficult to overcome. [0003] In order to achieve a better heat dissipation effect, the heat dissipation mechanism of some electronic products uses heat pipes with high heat conduction efficiency to conduct heat energy to heat dissipation fins. At present, although heat pipes have been widely used, in terms of heat dissipation issues, how to make heat dissipation mechanisms using heat pipes have better h...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G03B21/16
CPCF28D15/0233F28D15/0275F28F1/02F28F1/32F28D2021/0028F28D1/024F28F2250/02H05K7/20336G03B21/16H05K7/20136F28D15/02
Inventor 林宗庆陈志豪李式尧黄博圣
Owner CORETRONIC