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Processing method of flexible substrate

A processing method and a flexible technology, which are applied in the direction of electrical digital data processing, data processing input/output process, instruments, etc., can solve the problem of easy deformation of flexible substrates, and achieve the effect of avoiding deformation.

Inactive Publication Date: 2019-05-21
SHENZHEN LAIBAO HI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The object of the present invention is to provide a substrate processing method that solves the problem that flexible substrates are easily deformed when electronic components are installed, and the substrate processing method of the present invention does not require an additional bonding layer

Method used

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  • Processing method of flexible substrate
  • Processing method of flexible substrate

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Embodiment Construction

[0019] The embodiment of the present invention discloses a method for processing a flexible substrate 2, the specific method is as follows:

[0020] Specific process such as figure 1 shown, including the following steps:

[0021] The first step S1: providing a substrate 1 and a flexible substrate 2, the substrate 1 has a first surface 11 and a second surface 12 with high flatness oppositely arranged, and the flexible substrate 2 has an opposite Set the third surface 21 and the fourth surface 22 with high flatness, the flatness Ra of the first surface 11, the third surface 21 and the fourth surface 22 is 0.006-0.1um, and the roughness Rz is 0.05-0.1um ;

[0022] The second step S2: attach the flexible substrate 2 to the substrate 1 through the first surface 11 and the third surface 21, and the third surface 21 of the flexible substrate 2 is well bonded to the substrate. on the first surface 11 of the bottom 1;

[0023] The third step S3: providing a fixture 3;

[0024] The...

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Abstract

The invention provides a processing method of a flexible substrate. A substrate which can be stably combined with the flexible substrate and can be used for fixing the flexible substrate and preventing deformation is provided, a fixture is arranged at a circumferential edge of the flexible substrate and the substrate so that the substrate and the flexible substrate can be tightly combined, no bubbles between layers is generated, the flexible substrate cannot be draped, warpped and deflected, the position of the flexible substrate is enabled to be accurately fixed, the flexible substrate is prevented from being deformed, and the position deviation of the flexible substrate to affect manufacturing accuracy of the electronic component is further guaranteed to be prevented when an electronic component is arranged.

Description

technical field [0001] The invention relates to the technical field of touch display, in particular to a method for processing a flexible substrate. Background technique [0002] Flexible touch display products have many advantages, such as impact resistance, shock resistance, light weight, small size, and more convenient to carry. In recent years, flexible touch display technology has achieved rapid development. [0003] Although the current manufacturing methods of several flexible touch display devices have their own characteristics, they also have some similarities. For example, they all need to bond a layer of flexible substrate on a hard and flat hard substrate, and then Fabricate electronic components on the flexible substrate to complete the processing process of the flexible substrate, and then peel off the completed flexible substrate from the substrate. The reason for this is that in the process of manufacturing fine electronic components, the position and flatn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683G06F3/041G09F9/30
Inventor 王士敏周威云邓移好何春荣古海裕朱泽力李文祥
Owner SHENZHEN LAIBAO HI TECH
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