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Test Modules for Fingerprint Sensing Devices

A technology for testing modules and sensing devices, applied in the directions of measuring devices, measuring device casings, electronic circuit testing, etc., to achieve the effects of simple structure, uniform contact, and improved functional testing

Active Publication Date: 2022-01-18
FINGERPRINT CARDS ANACATUM IP AB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although fingerprint sensors are usually manufactured in high volumes with high manufacturing precision and high yields, the produced sensors still need to be tested, thus requiring efficient and automated testing procedures

Method used

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  • Test Modules for Fingerprint Sensing Devices
  • Test Modules for Fingerprint Sensing Devices
  • Test Modules for Fingerprint Sensing Devices

Examples

Experimental program
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Embodiment Construction

[0038] In the detailed description presented, various embodiments of systems and methods according to the present invention are described primarily with reference to capacitive fingerprint sensing devices. However, the described invention may also be applicable to other types of fingerprint sensing devices, such as ultrasonic or optical fingerprint sensing devices.

[0039] figure 1 A test module 100 according to an embodiment of the invention is schematically shown. The test module comprises an electrically conductive bottom element 102 comprising an outer surface portion 104 configured to be in contact with a sensing surface of a fingerprint sensing device 110 . The outer surface portion 104 thus refers to the bottom surface of the test module 100 , ie the surface facing the fingerprint sensing device 110 .

[0040] The test module 100 further comprises an electrically conductive intermediate element 106 connected to the bottom element 102 on the side opposite to the outer...

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PUM

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Abstract

A test module (100) for testing a fingerprint sensing device (110) is provided, comprising: a conductive bottom element (102) including an outer surface configured to contact a sensing surface of the fingerprint sensing device part; a conductive intermediate element (106) connected to the bottom element on the side opposite the outer surface, the middle element comprising a flexible material that enables the bottom element to respond to being pressed toward the bottom element at the outer surface the force that occurs when the exterior surface slopes to change alignment; and a top member (108) configured to connect the test module to the test fixture. Also provided is a method for testing a fingerprint sensing device using the described testing module.

Description

technical field [0001] The invention relates to a test module for testing a fingerprint sensing device. Background technique [0002] Biometric sensors, such as fingerprint sensors, are becoming more common in a variety of applications, such as computers, smart phones, smart cards, and other applications requiring biometric authentication. In particular, capacitive fingerprint sensors have been shown to provide accurate performance while being cost-effective and suitable for large-scale fabrication. [0003] Although fingerprint sensors are usually mass-produced with high manufacturing precision and high yields, the produced sensors still need to be tested, thus requiring efficient and automated testing procedures. Furthermore, in order to replicate the normal operating conditions of the sensor, when the sensor is tested it needs to be performed using a test structure that resembles a human finger as much as possible. [0004] In particular, the fingerprint sensor needs to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/28G01D1/18G01R1/04G01R1/06G06K9/00G06V40/13G06V10/98G06V40/12
CPCG06V40/13G06V10/98G06V40/1394G06V40/1306A61B2562/0233G01R35/007
Inventor 彼得·奥斯特伦
Owner FINGERPRINT CARDS ANACATUM IP AB
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