An optimization method for high-speed differential vias
A technology of differential vias and optimization methods, which is applied in the direction of electrical connection of printed components, printed circuit components, printed circuits, etc., can solve the problems of differential performance and common mode performance of differential vias, and achieve enhanced integrity, The effect of improving transmission performance
Active Publication Date: 2021-09-07
CHONGQING UNIV OF POSTS & TELECOMM
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Problems solved by technology
However, there are few researches on the center distance of the differential vias, the diameter of the anti-pad, the setting of the ground vias, and the differential performance and common mode performance of the differential vias by the non-functional structure.
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[0047] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the diagrams provided in the following embodiments are only schematically illustrating the basic concept of the present invention, and the following embodiments and the features in the embodiments can be combined with each other in the case of no conflict.
[0048] Wherein, the accompanying drawings are for illustrative purposes only, and represent only schematic diagrams, rather than physical drawings, and should...
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The invention relates to an optimization method for high-speed differential vias. Aiming at the design requirements of low reflection, high transmission and stable impedance of differential vias for differential signals and common-mode signals in high-speed printed circuit boards, an equivalent method is established for differential vias. Physical model and equivalent circuit model, using the double-rod transmission line model to analyze and predict the performance of differential vias, and determine the factors that affect the performance of differential vias, including via center distance, anti-pad diameter, non-functional structure and ground via settings. According to the model analysis, set the appropriate via hole center distance and anti-pad diameter, remove the non-functional structure of the differential via, and set equidistant double vias next to the differential via. The performance of the hole is optimized to provide a reference for high-speed differential via design.
Description
technical field [0001] The invention belongs to the field of high-speed printed circuit board design and relates to an optimization method for high-speed differential vias. Background technique [0002] In high-speed PCB design, since the differential structure has many advantages compared with the single-ended structure in terms of signal integrity such as anti-interference ability, EMI suppression, and timing positioning, the differential structure is often used in high-speed PCB design, and differential vias are also widely used. Connect the differential structures in different layers. Although the differential vias make interconnection easier, the discontinuity of the differential vias will also seriously affect the signal integrity. Its existence will cause problems such as impedance discontinuity and loss increase. Therefore, it is very important to study the characteristics of differential vias. [0003] Analyzing the performance of differential vias often requires t...
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IPC IPC(8): H05K1/02H05K1/11H05K3/00
Inventor 严冬陈杨杨贺开俊张盈利
Owner CHONGQING UNIV OF POSTS & TELECOMM