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Corrosion protection system and method for use with electrical contacts

An electroactive, contact area technology used in line connector maintenance, contact parts, liquid chemical plating, etc.

Active Publication Date: 2019-06-04
TE CONNECTIVITY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such porosity or defects are unavoidable due to thin layer noble metal protection or interface wear due to intercalation cycles

Method used

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  • Corrosion protection system and method for use with electrical contacts
  • Corrosion protection system and method for use with electrical contacts
  • Corrosion protection system and method for use with electrical contacts

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Embodiment Construction

[0014] Exemplary embodiments of the present invention will now be described with reference to the accompanying drawings. Reference numerals are used throughout the detailed description to refer to various elements and structures. Although the following detailed description contains many details for purposes of illustration, those of ordinary skill in the art will appreciate that many changes and modifications to the following details are within the scope of the invention. Accordingly, without loss of generality and without imposing limitation on the claimed invention, the following embodiments of the invention are set forth.

[0015] As previously stated, the present invention relates generally to corrosion protection and inhibition systems and methods, and more particularly to systems and methods for providing corrosion protection to electrical contacts, particularly those plated with noble metals such as gold . Electrical contacts located on the outer perimeter of the arra...

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PUM

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Abstract

A method for inhibiting corrosion in metal components such as electrical contacts, comprising providing a component (10), wherein the component includes a first metal layer; a second metal layer deposited on the first metal layer; at least one additional metal layer deposited on the second metal layer; and an electrically active contact region (12) on the uppermost layer of the at least one additional metal layer; and forming a defect (20) in the component in at least one predetermined location around the electrically active contact region, wherein the defect passes through the at least one additional metal layer to expose the second metal layer, through the at least one additional metal layer and second metal layer to expose the first metal layer, or a combination thereof.

Description

technical field [0001] The described invention relates generally to corrosion protection and inhibition systems and methods, and more particularly to systems and methods for providing corrosion protection to electrical contacts, particularly electrical contacts plated with a noble metal such as gold . Background technique [0002] The use of gold and other precious metals in the electronics industry has been an ongoing aspect of the development and expanding use of complex digital electronics and devices in many industry sectors. It is estimated that the electronics industry uses as much as 320 tons of gold each year for computers, mobile phones, tablets and other electronic devices. For electronic device applications, gold offers a combination of electrical conductivity, ductility and corrosion resistance at high or low temperatures. Corrosion resistance is one of the most important properties of gold in terms of its application in electronics. Gold's corrosion resistanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F13/16H01R13/03
CPCC23F13/16C23F2201/00C23F2213/21H01R13/03C25D7/00H01R43/002C23C14/30C23C14/14C23C18/42C23C18/31C25D3/46C25D3/38C25D3/22C25D3/12C23F15/00
Inventor 罗德尼·伊凡·马顿斯马丁·威廉·贝叶斯文森特·科罗纳·帕斯古奇丹尼尔·布里涅耳·施莱弗勒凯文·雷·莱博尔德
Owner TE CONNECTIVITY CORP