Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat-dissipating arrangement and method for the production thereof

A technology of equipment and heat conduction elements, which is applied in the manufacturing field of the preamble, can solve space problems and other problems, and achieve the effect of simple and cheap method and good heat conduction

Active Publication Date: 2019-06-04
ZF FRIEDRICHSHAFEN AG
View PDF30 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This can cause space issues when installing the equipment

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Heat-dissipating arrangement and method for the production thereof
  • Heat-dissipating arrangement and method for the production thereof
  • Heat-dissipating arrangement and method for the production thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] For better thermal connection or heat dissipation between the heat sink and the components arranged on the printed circuit board, the method according to the invention makes it possible to dispense with intermediate layers. For better heat-conducting connection of the cooling body, the heat-conducting element can be integrated directly into the cooling body, or it can be integrated as a separate component during manufacture. The heat-conducting element has a special structure and is preferably at least partially filled with a heat-conducting medium, hereinafter only referred to as medium. The medium can here be present with or without circulation in the closed heat-conducting element or be in contact with the respective component, ie the heat-conducting element has a direction along the component(s) on which it is arranged Open structure. Thermally conductive elements can also be purchased or manufactured as separate components to be mounted on one or more components a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Disclosed is a heat-dissipating arrangement, wherein the heat-dissipating arrangement has at least one power module which has a printed circuit board (2) having components (3) to be cooled arranged thereon, and at least one heat sink (1) arranged on the printed circuit board (2) and over the components (3) to be cooled. On at least one of the components (3) to be cooled there is at least one heat-conducting element (100) which has a predefined structure extending from the printed circuit board (2) away from the printed circuit board into the heat sink (1), the heat-conducting element (100) containing a heat-dissipating medium in the interior thereof.

Description

technical field [0001] The invention relates to a heat-discharging device according to the preamble of claim 1 , and to a manufacturing method according to the preamble of claim 7 . Background technique [0002] Heat-conducting elements such as heat sinks are used in power electronics and control units for cooling various components, for example components or structures on circuit boards. Due to tolerances and existing surface properties, direct contact of the heat sink to the component is not optimal for heat transfer. Therefore, in the currently known heat dissipation strategies, it is necessary to introduce a gap-filled and thermally conductive layer for better thermal connection, as in figure 1 as shown in reference number 4. Such a gap-filling and heat-conducting layer 4 can be a heat-conducting paste or a so-called caulk which is arranged on the corresponding component 3 , that is to say a component, structure or process which is arranged, for example, on the circuit...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F28D15/02
CPCH05K7/20336H05K7/20936F28D15/0233F28F2255/18H01L23/427B33Y80/00
Inventor 马蒂亚斯·霍伊斯尔曼马库斯·鲍恩芬德赫尔曼·约瑟夫·罗宾库尔特·米歇尔
Owner ZF FRIEDRICHSHAFEN AG
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com