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Fabrication method of double-sided crimped PCB and PCB

A production method and double-sided technology, applied in the direction of multi-layer circuit manufacturing, electrical connection formation of printed components, etc., can solve the problems of low product yield, difficult operation, complicated process, etc., to improve product yield and simplify the production process , the effect of reducing production costs

Active Publication Date: 2019-06-14
DONGGUAN SHENGYI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to provide a double-sided crimping PCB manufacturing method and PCB, which overcomes the defects of complex process, difficult operation and low product yield in the existing process

Method used

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  • Fabrication method of double-sided crimped PCB and PCB
  • Fabrication method of double-sided crimped PCB and PCB
  • Fabrication method of double-sided crimped PCB and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] see figure 1 , the present embodiment provides a method for making a double-sided crimped PCB, comprising steps:

[0050] Step 101, according to the preset stacking sequence, for the first core board located on the first designated layer and the second core board located on the second designated layer, respectively make a layer of dry film / ink on the preset area of ​​the board surface, such as figure 2 shown.

[0051] In this embodiment, according to processing requirements, the crimping hole to be processed can be divided into three hole sections along its axial direction: the upper hole section with metallized hole wall, the middle hole section with unmetallized hole wall and the metallized hole wall. the lower hole section. Based on this, the first specified layer is located at the boundary between the upper hole segment and the middle hole segment, and the second specified layer is located at the boundary between the lower hole segment and the middle hole segment...

Embodiment 2

[0072] see Figure 7 , the present embodiment provides another method for making a double-sided crimped PCB, comprising steps:

[0073] Steps 201 to 203 are the same as steps 101 to 103 in Embodiment 1, and will not be repeated here.

[0074] Step 204 , performing electroless copper deposition on the multilayer board, and depositing a layer of electroless copper deposition on the surface layer of the multilayer board and the hole walls of the crimping holes.

[0075] In this step, a layer of dense thin copper layer with a thickness of 0.1-1.0 microns will be deposited on the hole wall and surface layer through self-catalyzed redox reaction. The copper layer is conductive, so that the hole wall and the surface layer can be connected to facilitate subsequent The hole wall and the surface layer are electroplated with a copper layer at the same time.

[0076] Step 205 , performing a stripping operation to simultaneously remove the dry film / ink and the electroless copper layer on...

Embodiment 3

[0083] On the basis of Embodiment 1 and Embodiment 2, it can further include: making the outer layer circuit pattern; it has two ways of realization: the first is to make the outer layer after removing the invalid hole copper in the middle hole section of the crimping hole Layer circuit pattern, the second is to make the outer layer circuit pattern while removing the invalid hole copper in the middle hole section of the crimping hole.

[0084] The first is to make the outer circuit pattern after removing the invalid hole copper in the middle hole section of the crimping hole, including:

[0085] Step 1. Remove the invalid hole copper in the middle hole section of the crimping hole.

[0086] In this step, there are two ways to remove copper in invalid holes:

[0087] First, the whole board is electroplated to make the surface copper and hole copper thicker; then the whole board is protected by tin plating, so that the board surface and the copper surface of the effective hole ...

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Abstract

The invention relates to the technical field of PCBs, and discloses a fabrication method of a double-sided crimped PCB and the PCB. The fabrication method comprises the steps as follows: for two coreboards positioned on a first designated layer and a second designated layer, dry films / printing ink is prepared in preset regions of the board surfaces; a to-be-processed crimped hole comprises an upper hole section, a middle hole section and a lower hole section in the axial direction; the first designated layer and the second designated layer are located at a boundary between the adjacent hole sections; the core boards and other core boards are pressed to form a multilayer board; the multilayer board is drilled to form the crimped hole which is not metalized for the hole wall, and the dry films / the printing ink is left on the peripheries of the two ends of the middle hole section of the crimped hole; firstly film stripping is carried out to remove the dry films / the printing ink, and thenelectroless copper is carried out; or, firstly the electroless copper is carried out, and then the film stripping is carried out; electroplating is carried out; and hole copper of the middle hole section of the crimped hole is removed. The double-sided crimped PCB can be formed through one-time pressing operation, so that the production cost is greatly reduced, the fabrication process is simplified, and the product yield is effectively improved.

Description

technical field [0001] The invention relates to the technical field of PCB (Printed Circuit Board, printed circuit board), in particular to a method for making a double-sided crimped PCB and the PCB. Background technique [0002] With the continuous improvement of signal transmission rate, it is necessary to increase the wiring and crimping density of PCB, which has been improved from single-sided crimping to double-sided crimping technology. [0003] At present, the basic manufacturing process of the double-sided crimping backplane is as follows: firstly, two symmetrical sub-boards are made by one-time pressing, and then single-sided crimping holes are made on the two sub-boards, and then the two sub-boards are pressed twice. combined to form a motherboard. There are following defects in this manufacturing process using double pressing method: [0004] 1) Two pressing operations are required, and during the second pressing, it is difficult to control the amount of glue fl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46
Inventor 焦其正刘梦茹王小平
Owner DONGGUAN SHENGYI ELECTRONICS
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