Display device, display panel and packaging method thereof

A display panel and packaging method technology, which is applied to semiconductor devices, electrical components, circuits, etc., can solve the problems of occupying a large space, increase the bonding force, reduce the risk of gaps, and prevent water and oxygen from intruding into the display panel. Effect

Active Publication Date: 2021-11-02
BOE TECH GRP CO LTD
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0002] Currently, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display panels are more and more widely used, among which, the packaging of the display panel is directly related to the performance of the display, and thin film packaging is a common packaging technology, which can be used in An encapsulation layer is formed on the array substrate containing light-emitting devices for encapsulation. The existing encapsulation layer generally includes an organic layer on the light-emitting side of the array substrate and an inorganic layer covering the organic layer. However, in order to prevent the organic layer from For overflow, it is necessary to add a barrier dam on the display panel to block the organic layer, but this will take up a lot of space and make the frame of the display device wider

Method used

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  • Display device, display panel and packaging method thereof
  • Display device, display panel and packaging method thereof
  • Display device, display panel and packaging method thereof

Examples

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Embodiment Construction

[0046] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0047] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so...

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Abstract

The disclosure provides a display device, a display panel, and a packaging method for the display panel, and relates to the field of display technology. The display panel includes an array substrate, a first inorganic layer, a buffer layer and an organic layer, the first inorganic layer is arranged on the light-emitting side of the array substrate; the buffer layer includes a plurality of microspheres distributed on the surface of the first inorganic layer away from the array substrate; The organic layer covers the buffer layer and fills the gaps between the microspheres. The display panel of the present disclosure can reduce or omit the space occupied by the blocking dam, so as to make the bezel narrower.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a display device, a display panel, and a packaging method for the display panel. Background technique [0002] Currently, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) display panels are more and more widely used, wherein the packaging of the display panel is directly related to the performance of the display, and thin film packaging is a common packaging technology, which can be used in An encapsulation layer is formed on the array substrate containing light-emitting devices for encapsulation. The existing encapsulation layer generally includes an organic layer on the light-emitting side of the array substrate and an inorganic layer covering the organic layer. However, in order to prevent the organic layer from For overflow, it is necessary to add a blocking dam on the display panel to block the organic layer, but this will occupy a large space...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32H01L51/56
Inventor 王小芬孙中元倪静凯隋凯刘晓云靳倩董超
Owner BOE TECH GRP CO LTD
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