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Display substrate and manufacturing method thereof, display panel, display device

A technology for display substrates and display areas, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as affecting the adhesion of encapsulation adhesives and poor encapsulation effect of OLED display substrates, and achieve the effect of improving the encapsulation effect.

Active Publication Date: 2021-02-09
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, for special-shaped OLED display panels, the inkjet printing area overlaps with the encapsulation area. During the inkjet printing process, the encapsulation area will be printed with ink, which will affect the adhesion of the encapsulant. Therefore, the encapsulation of the OLED display substrate less effective

Method used

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  • Display substrate and manufacturing method thereof, display panel, display device
  • Display substrate and manufacturing method thereof, display panel, display device
  • Display substrate and manufacturing method thereof, display panel, display device

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Embodiment Construction

[0048] In order to make the purpose, technical solution and advantages of the application clearer, the application will be further described in detail below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0049] Compared with liquid crystal display (English: Liquid Crystal Display; abbreviation: LCD) display devices, OLED display devices have the advantages of self-illumination, fast response, wide viewing angle, high brightness, bright colors, and thinness, and are considered to be the next generation of display devices. technology.

[0050]The OLED display device includes an OLED display panel, and the OLED display panel includes an OLED display substrate and an encap...

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Abstract

The application discloses a display substrate, a manufacturing method thereof, a display panel, and a display device, which belong to the field of display technology. The display substrate includes: a base substrate, the base substrate has a display area and a packaging area, and the packaging area surrounds the display area; a hydrophobic structure is arranged in the packaging area, and the hydrophobic structure has an adhesive for bonding the packaging glue to the packaging area. access channel. The application can avoid the influence of the ink on the adhesiveness of the encapsulation glue, and improve the encapsulation effect of the display substrate. This application is used for special-shaped display panels.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a display substrate and a manufacturing method thereof, a display panel, and a display device. Background technique [0002] Organic Light-Emitting Diode (English: Organic Light-Emitting Diode; abbreviation: OLED) display device has the advantages of self-illumination, fast response, wide viewing angle, high brightness, bright color and thinness, etc., and is considered to be the most promising display in the display field. device. [0003] The OLED display device relies on an OLED display panel for display, and the OLED display panel includes an OLED display substrate and a packaging substrate that are oppositely arranged, and the OLED display substrate and the packaging substrate are fixed by an packaging glue disposed between them. Among them, the OLED display substrate includes a base substrate and a light-emitting functional layer (such as an organic light-emitti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L27/32H01L51/56
CPCH10K71/00H10K77/00H10K59/873
Inventor 侯文军
Owner BOE TECH GRP CO LTD