High-precision FPGA solder joint fault real-time diagnosis method and device

Abstract

The present invention discloses a high-precision FPGA solder joint fault real-time diagnosis method and device. The pins of two FPGA solder joints are connected with external capacitors, the two pinsare in a low-level state to discharge the external capacitors, then one pin is in a high-level state to charge the external capacitors, a high-frequency clock is employed to sample signals of the other pin to record the period number of sampling by the high-frequency clock to obtain the charging time of the capacitors to calculate the resistive values of the corresponding FPGA solder joints, determine whether the FPGA solder joints have faults or not and predict the lives of the FPGA solder joints. Single capacitors are employed to detect two solder joints to obtain more accurate solder jointresistive values in real time, and therefore, the high-precision FPGA solder joint fault real-time diagnosis method and device can be used for life prediction of the FPGA solder joints.

Description

technical field [0001] The invention belongs to the technical field of chip detection and relates to an FPGA solder joint fault detection technology, in particular to a high-precision FPGA solder joint fault real-time diagnosis method and a diagnostic device. Background technique [0002] Field Programmable Gate Array (FPGA) has obvious parallelism and has been widely used in electronic systems. Solder joint failure caused by thermal and mechanical stress is one of the most common failures in FPGAs. It is worth noting that this failure will lead to increased resistance of FPGA solder joints. [0003] Therefore, monitoring of FPGA solder joint resistance can be used to assess the health of the FPGA and provide data for FPGA fault and health management. Usually, when the resistance value of the solder joint of the FPGA exceeds 300Ω and lasts for more than 200 μs, it can be determined that the solder joint of the FPGA is faulty. [0004] The SJ-BIST (Solder Joint Built-In Sel...

AI Technical Summary

Problems solved by technology

[0004] The SJ-BIST (Solder Joint Built-In Selftest) method developed by the American Ruituo Group Company is used to diagnose FPGA solder joint faults. It only needs a single capacitor to detect two solder joints at the same time. The SJ-BIST method can be used in a few nanoseconds However, this method cannot obtain the resistance value of the detected solder joint, and can only diagnose whether the detected solder joint is faulty or not.

[0005] Although the existing FPGA solder joint diagnosis methods can detect the faults of FPGA solder joints, they cannot obtain more accurate solder joint resistance values ​​and predict the life of FPGA solder joints

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