Computer mainboard heat dissipation device

A computer motherboard and heat dissipation device technology, applied in the computer field, can solve the problems of reducing the heat dissipation effect of the motherboard, low heat dissipation efficiency, and lack of heat dissipation function of the motherboard, and achieve the effects of improving heat dissipation effect, increasing efficiency, and increasing the blowing area

Active Publication Date: 2019-06-25
ANHUI POLYTECHNIC UNIV MECHANICAL & ELECTRICAL COLLEGE
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main board will generate heat when it is working. Because the main board is installed in the case, the traditional main board does not have a heat dissipation function. Low heat dissipation efficiency reduces the heat dissipation effect of the motherboard

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Computer mainboard heat dissipation device
  • Computer mainboard heat dissipation device
  • Computer mainboard heat dissipation device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0022] The specific embodiment of the present invention will be described in further detail by describing the embodiments below with reference to the accompanying drawings, the purpose is to help those skilled in the art to have a more complete, accurate and in-depth understanding of the concept and technical solutions of the present invention, and contribute to its implementation.

[0023] like Figure 1 to Figure 4 As shown, the present invention provides a cooling device for a computer motherboard, comprising a bearing base, a cooling fan rotatably arranged on the bearing base and used to provide airflow to the motherboard, and a fan reset mechanism for controlling the cooling fan to reset. The fan includes a driving motor 5 which is rotatably connected to the bearing seat and fan blades 7 arranged on the driving motor 5 .

[0024] Specifically, as Figure 1 to Figure 4 As shown, the driving motor 5 is rotatably connected to the bearing seat through the rotating shaft 6 ,...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a computer mainboard heat dissipation device which comprises a bearing base, a heat dissipation fan rotationally arranged on the bearing base and used for providing air flow for a mainboard and a fan reset mechanism used for controlling the heat dissipation fan to reset, and the heat dissipation fan comprises a driving motor rotationally connected with the bearing base andfan blades arranged on the driving motor. According to the computer mainboard heat dissipation device, the heat dissipation effect of a computer mainboard can be improved, the heat dissipation fan isarranged to be rotatable, the air blowing area of the heat dissipation fan is increased, and the heat dissipation efficiency of the mainboard is improved.

Description

technical field [0001] The invention belongs to the technical field of computers, and in particular, the invention relates to a cooling device for a computer motherboard. Background technique [0002] Computer case motherboard, also known as motherboard, system board or motherboard, is installed in the case and is one of the most basic and important components of a microcomputer. The motherboard is generally a rectangular circuit board, on which are installed the main circuit systems that make up the computer. Generally, there are BIOS chips, I / O control chips, keys and panel control switch interfaces, indicator light connectors, expansion slots, motherboards and cards. DC power supply connectors and other components. [0003] The main board will generate heat when it is working. Because the main board is installed in the case, the traditional main board does not have a heat dissipation function. The heat dissipation efficiency is low, which reduces the heat dissipation ef...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
Inventor 张爱兵张秀娟
Owner ANHUI POLYTECHNIC UNIV MECHANICAL & ELECTRICAL COLLEGE
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products