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Multi-facet light-emitting chip-scale package led, manufacturing method thereof, and backlight module

A chip-level packaging and multi-faceted light-emitting technology, which is applied in optics, nonlinear optics, instruments, etc., can solve the problems of high cost and complex structure, and achieve the effects of reducing production cost, increasing luminous flux, and simple structure

Active Publication Date: 2021-04-06
WUHU JUFEI PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a multi-sided light-emitting chip-level package LED and its manufacturing method, and a backlight module. Level packaging of LEDs combined with lens design or the use of special diffusers leads to complex structures and high costs

Method used

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  • Multi-facet light-emitting chip-scale package led, manufacturing method thereof, and backlight module
  • Multi-facet light-emitting chip-scale package led, manufacturing method thereof, and backlight module
  • Multi-facet light-emitting chip-scale package led, manufacturing method thereof, and backlight module

Examples

Experimental program
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Effect test

Embodiment 1

[0062]In order to solve the problem of a high cost of the existing single-sided light-emitting chip-level package LEDs, this embodiment provides a method of making a multi-faceted chip-level package LED, and specific can be found.figure 2 ,include:

[0063]S201: Set at least one column flip LED chip on the bottom membrane.

[0064]Such asimage 3 As shown, at least one column flip LED chip 302 is arranged on the bottom film 301.

[0065]It will be understood that at least one column flip LED chip is arranged on the bottom membrane can be arranged in the bottom membrane to set a column flip LED chip, or arrange two columns on the bottom membrane to set up flip LED chips, or on the bottom film. Arrange to set up three columns flip LED chips. Among them, each column should include at least one flip LED chip.

[0066]It should be noted that in the present embodiment, the bottom film may be a planar film, or a film having a uneven structure. When the bottom film is a film having a concave-convex stru...

Embodiment 2

[0097]In order to better understand the present invention, this embodiment will be described in connection with more specific examples.Figure 10 DistanceFigure 10 The improvement of the method of fabricating a multi-faceted chip-level package LED provided in the second embodiment of the present invention, the manufacturing method of the plurality of light-emitted chip-level package LEDs, including:

[0098]S1001: Set at least one column flip LED chip on the bottom membrane.

[0099]In this embodiment, please seeFigure 11 The bottom film 1101 is a high temperature thermoexe having a groove, and the flip-load chip 1102 is arranged on the recess of the bottom film 1101, and the side light-emitting surface of the flip LED chip 1102 is located outside the groove, and the LED chip 1102 is flipped. The height of the bottom electrode is equal to the height of the groove.

[0100]S1002: The light-emitting transducer layer covering the front light surface of the flip LED chip is formed on the bottom m...

Embodiment 3

[0125]This embodiment provides a multi-faceted chip-level package LED, which can be produced by the method exemplified by the above embodiments, and other preparation methods can be produced. The plurality of shining chip-level package LEDs include: flipped LED chips, the flip-loaded LED chip has a front light emitting surface and a relative first side surface, the second side surface, and the relative third side surface, and the first For the four side, please seeFigure 20 , The first side surface of the flip-load chip 2001 is opposed to the first side surface, and the second side surface can be surface 2002 and surface 2204, and may be surface 2005 and surface 2003.

[0126]The plurality of shining chip-level package LEDs also include light-emitting gelatin layers covering the front light surface of the flipped LED chip, the first side surface, and the second side surface, and the third side surface shines and the fourth side surface Face covered reflective layer. Among them, the lig...

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PUM

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Abstract

The invention provides a chip-level packaged LED with multi-sided light emitting, a manufacturing method thereof, and a backlight module. Luminescence conversion adhesive layer, a reflective adhesive layer that covers the other two side light-emitting surfaces, that is, the chip-scale package LED includes three light-emitting surfaces. LEDs in chip-level packaging can reduce the phenomenon of dark areas between LEDs in chip-level packaging; the backlight module provided by the present invention includes the above-mentioned multi-faceted chip-level package LEDs. The number of level-packaged LEDs reduces the manufacturing cost; the manufacturing method of the chip-scale packaged LED with multi-sided light emission provided by the present invention can produce the above-mentioned multi-sided light-emitting chip-scale package LED.

Description

Technical field[0001]The present invention relates to the field of the LED, and more particularly to a method of fabricating a multi-faceted chip-level package LED.Background technique[0002]With the development of CSP LED (Chip Scale Package Light Emitting Diode, chip-level encapsulating diode), the application environment of chip-level package LEDs is increasing, and the market's requirements for chip-level packaging LEDs are getting higher and higher.[0003]Currently, please seefigure 1 The chip-level package LED includes a flipped LED chip 101, a phosphor layer 102, and a reflected whitelastic layer 103. Therefore, the existing chip-level package LED only has a top light, and the side does not illuminate, but because there is a certain interval between the chip-level package LED, there is a significant dark area between the chip-level package LED, in order to eliminate the chip The dark zone between the level package LEDs, prior art By using densely set LED devices to reduce the d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/60G02F1/13357
Inventor 邢其彬龚涛张攻坚施华平张志宽姚亚澜
Owner WUHU JUFEI PHOTOELECTRIC TECH CO LTD