MEMS chip testing socket and heating temperature measurement method

Abstract

The invention provides a chip testing socket. The socket comprises a base, an upper cover, a temperature sensor and a heating element; the upper cover is relatively fixed to the base through a fixingassembly; a first groove is formed in the center of the upper surface of the base and is used for containing a chip to be tested; a first spring probe set is arranged on the periphery of the bottom surface of the first groove, one end of the first spring probe set is used for being in contact with a pin of the chip to be tested, and the other end of the first spring probe set extends out of the bottom surface of the base and is used for being electrically connected with a PCB; a second groove is further formed in the bottom of the first groove; the temperature sensor is arranged in the secondgroove, so that when the chip testing socket works, the temperature sensor is in contact with the chip to be tested; a second spring probe set is arranged on the bottom surface of the second groove, one end of the second spring probe set is used for being in contact with a pin of the temperature sensor, and the other end of the second spring probe set extends out of the bottom surface of the baseand is used for being electrically connected with the PCB; and the heating element is connected with an external power supply through a power line and is used for heating the chip to be tested. According to the chip testing socket, the heating period of the chip is shortened to be a few minutes, the temperature measurement is more accurate and faster, and the continuous testing is facilitated.

Description

technical field [0001] The invention relates to the field of MEMS chip testing, in particular to a MEMS chip testing socket. Background technique [0002] Micro-Electro-Mechanical Systems (MEMS) are micro-structures, micro-sensors, control processing circuits, and even interfaces, communications, and power supplies that are fabricated on one or more chips by using integrated circuit manufacturing technology and micro-processing technology. integrated system. In the process of testing the MEMS chip, it is usually necessary to fix the test socket on the PCB board for testing, and communicate with the PCB board through wires (such as spring probes). When temperature compensation is required to determine whether there is temperature drift in the chip, the current common practice is to put the entire test PCB board with the chip and test socket fixed in a constant temperature oven for heating, and set a temperature sensor on the PCB board to detect the environment overall tempe...

AI Technical Summary

Problems solved by technology

[0004] In view of this, the present invention provides a chip test socket and its heating and temperature measurement method to solve the problems of long test period and inability to test continuously in existing test methods

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