Cover plate and preparation method and laminating method thereof

A cover plate and glass plate technology, applied in branch equipment, telephone structure, telephone communication, etc., can solve the problems of low lamination efficiency of cover plates, and achieve the effect of reducing lamination difficulty and improving lamination efficiency.

Inactive Publication Date: 2019-07-12
BAZHOU YUNGU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The embodiment of the present application provides a cover plate and its preparation method and bonding method to solve the problem of low bonding efficiency of the cover plate in the prior art solution

Method used

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  • Cover plate and preparation method and laminating method thereof
  • Cover plate and preparation method and laminating method thereof
  • Cover plate and preparation method and laminating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] see figure 1 As shown, the embodiment of the present application discloses a cover plate, and the cover plate includes a flexible glass plate 11 and a memory alloy frame 12 . The memory alloy frame 12 is located in the flexible glass plate. The memory alloy frame 12 includes an initial state and a deformed state. The memory alloy frame in the initial state drives the flexible glass plate to remain in a curved shape, and the memory alloy frame in the deformed state Drive the flexible glass plate to keep it in a flat shape.

[0033] In the embodiment of the present invention, the memory alloy frame includes two states (initial state and deformation state). The state thus drives the shape of the flexible glass plate to become a curved surface. The memory alloy frame can be a rectangular frame or a "day" shape. The present invention does not limit its specific shape, as long as it can drive the shape of the flexible glass plate into a curved shape.

[0034] It is pointed...

Embodiment 2

[0052] Based on the cover described in the above embodiments, the embodiment of the present application provides a preparation method for the above cover, which may specifically include the following steps:

[0053] Step S21, controlling the memory alloy frame to remain in a deformed state, the memory alloy frame in the deformed state is flat, and the memory alloy frame also includes a curved initial state;

[0054] In the embodiment of the present application, the memory alloy frame is controlled to remain in a deformed state, the memory alloy frame in the deformed state is flat, and the memory alloy frame also includes an initial state in a curved shape.

[0055] Specifically, in the embodiment of the present application, by heating the memory alloy frame, such as heating to 38-42 degrees Celsius, such as 38 degrees Celsius, 40 degrees Celsius or 42 degrees Celsius; after that, performing cooling mechanical treatment on the memory alloy frame, Cool the memory alloy frame to ...

Embodiment 3

[0071] Based on the cover plate and the preparation method of the cover plate described in the above-mentioned embodiments, the embodiment of the present application provides a bonding method for bonding the above-mentioned cover plate or the cover plate prepared by the above-mentioned preparation method to the light-emitting device, see image 3 As shown, the bonding method disclosed in the embodiment of the present application includes:

[0072] Step S31, attaching the planar cover plate to the display panel, at this time, the memory alloy frame in the cover plate is in a deformed state;

[0073] In the embodiment of this application, the planar cover plate is bonded to the display panel to form a Figure 4 As shown in the schematic diagram of the structure, specifically, the bonding position can be:

[0074] The center of the planar cover overlaps with the center of the display panel, so that the display panel can be effectively attached to the central area of ​​the flexib...

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Abstract

The invention discloses a cover plate and a preparation method and a laminating method thereof, and the cover plate comprises a flexible glass plate; and the memory alloy frames which are located in the flexible glass plate, the memory alloy frames are in an initial state and a deformation state, the memory alloy frame in the initial state drives the flexible glass plate to be kept in a curved surface shape, and the memory alloy frame in the deformation state drives the flexible glass plate to be kept in a plane shape. According to the cover plate provided by the technical scheme, the lamination of the curved surface cover plate can be converted into the lamination of the plane cover plate, the lamination difficulty is reduced, the lamination efficiency is improved, and meanwhile, the yield of products is improved.

Description

technical field [0001] The present application relates to the technical field of flexible cover plates, in particular to a cover plate, a preparation method of the cover plate and a bonding method. Background technique [0002] With the development of display technology, flexible display products are becoming more and more sought after by many mobile phone manufacturers. During the production process of the flexible display, the cover plate and the display panel need to be bonded together. [0003] In the existing technical solutions, the technology used to attach the cover plate to the display panel is to directly attach the curved cover plate to the display panel. Since the curved cover plate is designed to be curved, the cover plate and the display panel The bonding requires the two to be closely bonded, which undoubtedly makes the bonding difficult and the bonding efficiency is low. [0004] Based on the above analysis, there is a lack of a cover plate with high lamina...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02
CPCH04M1/0249H04M1/0268H04M1/0283
Inventor 陈利君刘佳琛
Owner BAZHOU YUNGU ELECTRONICS TECH CO LTD
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