45results about How to "Reduce the difficulty of fitting" patented technology

The invention discloses an I-V (Current-voltage) model parameter extraction method based on a gallium nitride high electronic mobility crystal valve. The method comprises the following steps of according to the physical meaning of the parameters of an I-V model, blocking the model parameters, decreasing the complicated degree of the I-V model, fitting transfer characteristic curves of actually-measuring pulse I-V and static I-V, extracting the model parameters of the corresponding block. Compared with the traditional parameter extraction method, the method disclosed by the invention has the advantages that the parameter extraction of the I-V model can be quickly and accurately completed, and the modeling efficiency of devices is greatly improved.

The invention discloses a curved screen and flat panel display module full-lamination method, which comprises the following steps: designing and manufacturing a frame, fixing a frame-pasting curved screen and the frame through a positioning fixture, injecting liquid optical cement, putting a flat panel liquid crystal display module, fixing through the positioning fixture to form an integrated screen, putting the positioning fixture and the integrated screen into a heating device and carrying out heating curing, removing the positioning fixture and the integrated screen out of the heating device after completing the above steps, dismounting the positioning fixture, removing spilled cement residue at the edge of the frame and completing lamination. The invention also discloses a curved screen and flat panel display module full-laminated integrated screen prepared according to the above processing method. By arranging the frame between the curved screen and the flat panel liquid crystal display module, lamination of a curved-surface product is converted into traditional flat-panel type lamination. The operation steps are simple. Investment in equipment and fixture is less. Batch production is convenient to realize.

The invention relates to a trajectory planning method for an intelligent driving system. The system includes the following steps that: step 1, an optimal aiming distance is determined according to theacquired current vehicle speed of a vehicle; step 2, the point coordinates of a preset number of position points located in front of the vehicle are acquired, the radius of curvature of each positionpoint is calculated separately; step 3, a pre-aiming point is determined according to the radius of curvature of each position point and the optimal aiming distance; and step 4, on the basis of a preset curve fitting model, the planned trajectory of the vehicle is determined according to the pre-aiming point. According to the trajectory planning method for the intelligent driving system, the vehicle state of the intelligent driving vehicle is adopted as the reference information of trajectory planning, and therefore, the planned trajectory is more likely to satisfy a vehicle dynamics model, and the trajectory tracking process of the intelligent driving system is more stable and safer.

The invention discloses a 3D-printing cervical vertebra side block screw guide embedded plate and a manufacturing method thereof. The embedded plate is printed through 3D printing technology and comprises one or multiple guide plates, one to multiple side block screw guide screw paths and one to multiple spinous holes formed in the center or one side of the guide plate, the upper portion of the guide plate is a plane, the curved surface of the bottom of the guide plate is reversely uniform with a cervical vertebra side block vertebral plate, the curved surface of the bottom of the guide plate is uniform to the outer side of a side block, and the plane of the upper portion of the guide plate extends to an outlet, in the upper-portion plane, of the corresponding screw path and then extends for 2-5mm. When multiple guide plates are arranged, connecting components are arranged among the guide plates. In order to guarantee stability of the guide embedded plate, fixing needles different in amount are arranged on the guide plates, and fixing clamps are arranged beside the spinous holes. The 3D-printing cervical vertebra side block screw guide embedded plate is simple and reasonable in structure and convenient to use, a screw feeding guide screw path can be provided for cervical vertebra side block screws effectively, accuracy (depth and direction) of screw feeding is guaranteed, and operating difficulty and operating risk are reduced.

The invention belongs to the technical field of LEDs, and particularly discloses a three-dimensional luminous LED device and a manufacturing method thereof. The LED device comprises a first directly mounted LED chip and a second directly mounted LED chip, wherein the first directly mounted LED chip and the second directly mounted LED chip are arranged oppositely. An N electrode leading-out metal sheet is electrically connected between an N electrode bonding layer of the first directly mounted LED chip and an N electrode bonding layer of the second directly mounted LED chip, a P electrode leading-out metal sheet is electrically connected between a P electrode bonding layer of the first directly mounted LED chip and a P electrode bonding layer of the second directly mounted LED chip, and the outer surface of the first directly mounted LED chip and the outer surface of the second directly mounted LED chip are respectively provided with a light conversion material layer. The three-dimensional luminous LED device is large in light-emitting area and has the advantages of being good in heat dissipation performance, easy to manufacture and process, high in product yield and long in service life.

The invention discloses a special AB double-sided adhesive for a low-residue electronic screen. The special AB double-sided adhesive for the low-residue electronic screen is successively provided with a first release layer, a modified silicon layer, a PET substrate layer, an optical adhesive layer and a second release layer from top to bottom, wherein the modified silicon layer comprises the following components in parts by weight: polydimethylsiloxane 100 parts, amino silicone 8-10 parts, sodium methyl silicate 4-6 parts and epoxy resin 2-3 parts. Adhesive components of two sides of the AB double-sided adhesive are modified to improve automatic bubble discharge capacity of the silicon layer, so that after the double-sided adhesive are torn and adhered repeatedly, the bubble discharge capacity can still be excellent, and adhesion difficulty of the double-sided adhesive is reduced; and meanwhile, the light transmittance, the adhesion strength and the shock resistance of the optical adhesive layer are improved, and residual adhesive ratio is reduced. The AB double-sided adhesive is suitable for the field of electronic screens and the like.

The invention provides a curved surface fitting clamp, a curved surface fitting device and a curved surface fitting method. The curved surface fitting clamp comprises a first cavity, a second cavity,at least one fluid flow passage, and at least one piston push rod, wherein the first cavity is provided with a first curved surface groove; the second cavity is an elastic material, and is provided with a second curved surface boss which is opposite to the first curved surface groove and is matched with the shape of the first curved surface groove; at least one side in a to-be-fitted display panelassembly is bent to form a curved edge in the lamination process, and the curved edge is internally provided with a to-be-fitted part; the at least one fluid flow passage is formed in the second cavity; and the at least one piston push rod is arranged at one end of the at least one fluid flow passage, and used for pressurizing a fluid in the fluid flow passage, so that the bent portion of the second curved surface boss at the other end of the fluid flow passage is deformed and is abutted against the to-be-fitted part to fit a protective layer. The curved surface fitting clamp can fit the interior of bent parts with different curvatures, reduces the fitting difficulty, and improves the fitting quality.

The invention discloses a predistortion device for a power amplifier and a parameter selection method thereof. According to the device and the method, the analog fitting degree of a power amplifier back inverse model is high, and the coefficient resolving precision of a predistorter is high. The device comprises a predistortion model operation processor which is used for establishing a predistortion model expression based on a memory polynomial, wherein the order of each memory item in the memory polynomial is determined by a vector parameter corresponding to the memory item in a first vector parameter group; and the predistorter which is used for receiving an input signal and obtaining an output signal according to the predistortion model expression.

The invention discloses a radar radiation source identification method based on a multistage jumper residual network, and belongs to the field of image processing. The radar radiation source identification method comprises the following steps: performing time-frequency transformation on a radar radiation source signal to generate a time-frequency image of the radar radiation source signal; carrying out the preprocessing of the time frequency image through an ImageDataGenerator, so as to obtain a one-dimensional time frequency image; and inputting the one-dimensional time-frequency image into a deep residual network for feature extraction and signal classification so as to identify and obtain the radar radiation source. According to the radar radiation source identification method based on the multistage jumper residual network provided by the invention, eight sequentially connected residual blocks are arranged in a deep residual network and are connected by using jumpers to form four residual units, so that the constructed deep residual network with the total convolution layer number of 18 can extract deep information of a signal time-frequency image, and meanwhile, the problems of gradient disappearance, gradient explosion and the like of the network are also avoided.

The invention discloses a fast probabilistic power flow calculation method of an improved extreme learning machine considering power flow characteristics. The method mainly comprises the steps of 1) obtaining basic data of a power network; 2) establishing a mapping relationship f: Pi, Qi to Ui, [theta]i based on the basic data of the power network; 3) decomposing the mapping relationship, and establishing an extreme learning machine neural network; 4) optimizing hidden layer parameters of the extreme learning machine neural network so as to establish an improved extreme learning machine neuralnetwork; 5) inputting the basic data of the power network into the improved extreme learning machine neural network, and calculating to obtain the probabilistic power flow of the power network. According to the invention, a time-consuming solving process for a large-scale high-dimensional complex nonlinear power flow equation in PPF calculation of a high-precision simulation method is replaced, so that engineering actual requirements of PPF calculation on precision and speed are considered.

The invention discloses a display device and a manufacturing method thereof. The display device comprises a display panel, a first cover plate and a second cover plate, wherein the display panel comprises a first main display surface, a second main display surface, an auxiliary display surface, a first bent display surface, a second bent display surface and a third bent display surface; the first main display surface is connected between the first bent display surface and the second bent display surface which are oppositely arranged, and the second main display surface is connected between the third bent display surface and the auxiliary display surface; and a first cover plate is attached to the first main display surface, the first bent display surface and the second bent display surface, and a second cover plate is attached to the second main display surface, the auxiliary display surface and the third bent display surface. Omnibearing display of the display panel can be guaranteed, the fitting difficulty of the display panel and the cover plate is simplified, and a fitting yield is increased.

The invention discloses a chip stacking and packaging method and a packaging structure. The method comprises: a first stacking module is prepared, wherein the first stacking module comprises a first chip, a first packaging body and a first stacking connecting piece; the first packaging body packages the first chip, the first stacking connecting piece is arranged in the first packaging body, one end of the first stacking connecting piece is coupled with the first chip, and the other end of the first stacking connecting piece is exposed out of the first packaging body through a groove, corresponding to the first stacking connecting piece, in the first packaging body; a second stacking module is prepared; the second stacking module comprises a second chip, a second packaging body and a secondstacking connecting piece; the second packaging body packages the second chip, one end of the second stacking connecting piece is coupled with the second chip, and the other end of the second stacking connecting piece extends in the direction away from the second chip; and the second stacking connecting pieces are coupled to the corresponding first stacking connecting pieces through the grooves.By implementing the method, the preparation cost of the chip stacking and packaging structure can be reduced, and the yield of products is improved.

The invention discloses a semiconductor deposition process compensating method, a compensating device and semiconductor deposition equipment. The deposition process compensating method comprises the following steps: step 1, judging whether process parameter values of a current process step need parameter compensation or not before performing the current process step, obtaining a current target material consumption value, and calculating compensated process parameter values according to the preset multiple target material consumption values and the parameter compensation value which correspondsto each target material consumption value if the parameter compensation is needed; and step 2, performing the current process step according to the compensated process parameter values, wherein the parameter compensation values comprise at least one of the following: a deposition time compensation value, a target base distance compensation value and a sputtering power compensation value. The semiconductor deposition process compensating method has the beneficial effect that: a user can freely select independent opening time compensation, sputtering power compensation or target base distance compensation, also can simultaneously start any two or three of the ways, and flexible configuration in the step of each process formula is achieved.

The invention discloses a fruit detection and yield estimation method and system based on machine vision, and relates to the technical field of artificial intelligence target recognition and application. In order to solve the problem that fruit yield estimation is not accurate enough in the prior art, fruit video stream data sets of three view angles are collected; designing a CSP module based on a Transform encoder and an attention feature fusion mechanism, and integrating the CSP module into YOLOv5 to construct a target detection model YOLOv5-FF based on multi-level feature fusion neck; focal EIoU Loss is adopted as a frame loss function for training to obtain a fruit target detection model, a detection result of a YOLOv5-FF model for continuous frame images of a fruit video stream is input into a target tracking model Deep Sort, exclusive numbers are distributed for successfully matched fruits through cascade matching and an IoU matching mechanism, the number of fruits under multiple view angles is obtained, the fruit detection efficiency is improved, and the fruit quality is improved. The deployment is convenient, and the detection is efficient and accurate; the provided yield estimation model can realize high-precision measurement and calculation of the yield of the orchard.