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Polishing apparatus, polishing method and computer-readable recording medium

A technology of grinding device and grinding pad, which is applied in grinding device, grinding machine tool, abrasive surface adjusting device, etc. to achieve the effect of improving accuracy

Pending Publication Date: 2019-07-19
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is difficult to detect the change of friction force from the change of the motor current of the top ring and the grinding table

Method used

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  • Polishing apparatus, polishing method and computer-readable recording medium
  • Polishing apparatus, polishing method and computer-readable recording medium
  • Polishing apparatus, polishing method and computer-readable recording medium

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0111] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each of the following embodiments, the same reference numerals are assigned to the same or corresponding components, and overlapping descriptions will be omitted.

[0112] figure 1 It is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment of the present invention. Such as figure 1 As shown, this substrate processing apparatus includes a frame portion, that is, a substantially rectangular housing 61 in this embodiment. The housing 61 has a side wall 700 . The inside of the casing 61 is divided into a loading / unloading section 62 , a grinding section 63 , and a cleaning section 64 by the partition walls 1 a and 1 b. The loading / unloading unit 62, the grinding unit 63, and the cleaning unit 64 are assembled independently and exhausted independently. In addition, the substrate processing apparatus has a...

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PUM

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Abstract

A polishing apparatus, a polishing method and a computer-readable recording medium are provided. The accuracy of polishing end point detection can be improved in a scheme of holding a top ring at an end portion of a swing arm. A polishing pad is held using a polishing table. The polishing table is driven to rotate using a first electric motor. The top ring for holding a semiconductor wafer and pressing the top ring against a polishing pad is driven to rotate by a top ring motor. The top ring is held by the swing arm. The swing arm is made to swing around a swing center on the swing arm by a swing shaft motor. A first output is generated by detecting a current value of the swing shaft motor. While polishing the semiconductor wafer by causing the semiconductor wafer to swing around the swingcenter on the swing arm, a change of a frictional force between the polishing pad and the semiconductor wafer is detected by increasing a change amount of the first output.

Description

technical field [0001] The invention relates to a grinding device and a grinding method. Background technique [0002] In recent years, with the trend toward higher integration of semiconductor devices, the wiring of circuits has been miniaturized, and the distance between wirings has gradually become narrower. In the manufacture of semiconductor devices, a plurality of materials are repeatedly formed into films on a semiconductor wafer to form a laminated structure. In order to form this laminated structure, a technique for flattening the surface of the semiconductor wafer is important. As one means for flattening the surface of such a semiconductor wafer, a polishing apparatus (also referred to as a chemical mechanical polishing apparatus) that performs chemical mechanical polishing (CMP) is widely used. [0003] This chemical mechanical polishing (CMP) device generally has: a polishing table, a polishing pad is installed on the polishing table, and the polishing pad is ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/005B24B37/20B24B37/27B24B37/34
CPCB24B37/20B24B37/27B24B37/34B24B37/005B24B27/0023B24B37/205B24B37/32B24B49/105B24B49/12B24B49/16B24B53/017B24B57/02B24B37/105B24B37/013B24B37/04B24B49/10H01L21/304
Inventor 铃木佑多高桥太郎
Owner EBARA CORP