To obtain a mask blank capable of suppressing build-ups after removing a resist film on a peripheral edge of a substrate and free of resist residues, even if using any kind of resist. In an unnecessary film removing step of a mask blank manufacturing steps, for removing the unnecessary resist film from a substrate 10 formed with a resist film 13 on a prescribed light-shielding film 12, the surface of the substrate on the side formed with the resist film 13 is covered with a cover member 30. First, while the substrate 10 is rotated with a prescribed rotation speed R1, the unnecessary resist film is dissolved by a chemical liquid 50. Next, while the substrate 10 is rotated with a prescribed rotation speed R2, the dissolved unnecessary resist film is removed. Further, while the substrate 10 is rotated with a prescribed rotation speed R3, the area from which the resist is removed is dried. In such a case, R1, R2, and R3 are expressed by (I) R1=100 to 500 rpm, (II) R2≧300 rpm, (III) R1<R2≦R3.