Three-stage detection method and device for PCBA production
A detection method and three-stage technology, applied in the field of detection, can solve the problem of low level of PCBA intelligence, and achieve the effect of improving the quality of PCBA products and alleviating the low level of intelligence.
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Embodiment 1
[0062] The embodiment of the present invention provides a three-stage detection method for PCBA manufacturing, which is applied to a server, and the above server is equipped with a production control system;
[0063] Preferably, the above-mentioned production control system is an MES production system, and the MES system is equipped with a database, and the above-mentioned database is loaded with all reference data required in the detection process.
[0064] The core of the invention is to detect the PCBA production line and PCBA products according to the thinking before the production process, during the production process and after the production.
[0065] like figure 1 As shown, the steps of the above-mentioned three-stage detection method for PCBA manufacturing include: S101: Obtain the process parameters of the PCBA production line before the PCBA line is started;
[0066] Specifically, the process parameters of the above PCBA production line include the furnace temperat...
Embodiment 2
[0082] The embodiment of the present invention provides a possible implementation of real-time detection in the PCBA production process, combined with figure 1 and image 3 , the embodiment of the present invention includes the following steps:
[0083] After executing S103, the step to be executed is S301: during the PCBA production process, the process parameters of the PCBA production line and the PCBA product parameters are detected respectively;
[0084] It should be noted that the above steps of S301 include: real-time detection of the furnace temperature value of the PCBA production line, the humidity value of the PCBA production line, the pressure value of the PCBA production line, the thickness of the solder paste of the PCBA product, the area of the solder paste of the PCBA product, and the volume of the solder paste of the PCBA product;
[0085] Conduct AOI testing, ICT testing and FCT testing on PCBA products;
[0086] Further, in actual production, PCBA produc...
Embodiment approach
[0104] like Figure 5 As shown, the embodiment of the present invention provides step S302 in step embodiment two: based on the detection results of PCBA production line process parameters and PCBA product detection results, it is possible to determine whether the PCBA production line process parameters and PCBA product parameters meet the second requirement implementation, the specific steps include:
[0105] S501: call PCBA production line process parameter reference data and PCBA product parameter reference data;
[0106] Specifically, the process parameters of the above PCBA production line include: the furnace temperature value of the PCBA production line, the humidity value of the PCBA production line, and the pressure value of the PCBA production line. The above PCBA product parameters include: PCBA product solder paste thickness, PCBA product solder paste area and PCBA product solder paste Volume, AOI yield, etc.;
[0107] After performing the step of S501, perform S...
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