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Flip structure and wafer drying equipment

A technology of flipping structures and wafers, which is applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve problems such as waste of manpower, low efficiency of wafer drying equipment, wafer pollution, etc., to liberate manpower and reduce manpower Opportunity to touch the carrier box and the effect of reducing the risk of contamination

Active Publication Date: 2021-07-13
BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flipping structure to alleviate the technical problems of low efficiency of wafer drying equipment in the prior art, waste of manpower and easy contamination of wafers

Method used

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  • Flip structure and wafer drying equipment
  • Flip structure and wafer drying equipment
  • Flip structure and wafer drying equipment

Examples

Experimental program
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Embodiment 1

[0051] see Figure 1-Figure 6 As shown, this embodiment provides an inversion structure, which is applied to wafer drying equipment. The inversion structure includes a carrier box 1, a turntable 2 and an inversion device 4; the carrier box 1 is rotatably connected to the turntable 2; the inversion device 4 is driven and connected The carrier box 1 is capable of driving the carrier box 1 to turn over on the turntable 2 .

[0052] It should be noted that when the wafer needs to be dried, the wafer is placed in the carrier box 1. Specifically, the carrier box 1 is driven to rotate relative to the turntable 2 by the turning device 4, so that the carrier box can be turned over. Make the carrier box 1 turn over to facilitate placing the wafer in the carrier box 1; after the wafer is dried, the wafer in the carrier box 1 needs to be taken out, specifically, the carrier box 1 is driven by the turning device 4 Rotating relative to the turntable 2 realizes the overturning of the carrier ...

Embodiment 2

[0076] Embodiment 2 provides a wafer drying equipment. The wafer drying equipment includes the flipping structure of Embodiment 1. The technical features of the flipping structure disclosed in Embodiment 1 are also applicable to this embodiment. The disclosure of Embodiment 1 The technical features of the flip structure will not be described repeatedly. The implementation of the wafer spin-drying equipment will be further described in detail below in conjunction with the accompanying drawings.

[0077] In order to save space, the improved features of this embodiment are also reflected in Figure 1-Figure 6 in, therefore, combined with Figure 1-Figure 6 The configuration of this example will be described.

[0078] see Figure 1-Figure 6 As shown, the wafer drying equipment provided in this embodiment, including the flip structure, further alleviates the technical problems existing in the prior art that the wafer drying equipment has low efficiency, wastes manpower, and easi...

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Abstract

The invention relates to the technical field of semiconductor wafer processing devices, in particular to an inversion structure and wafer drying equipment. The overturning structure is applied to the wafer drying equipment, including a carrier box, a turntable and a turning device; the carrier box is rotatably connected to the turntable; the turning device drives and connects the carrier box, and can drive the carrier box to turn over on the turntable. Wafer spin-drying equipment includes a flipping structure. The invention provides a flipping structure and wafer drying equipment, so as to alleviate the technical problems of wafer drying equipment in the prior art, such as low efficiency, waste of manpower, and easy pollution to wafers.

Description

technical field [0001] The invention relates to the technical field of semiconductor wafer processing devices, in particular to an inversion structure and wafer drying equipment. Background technique [0002] Wafer refers to the silicon wafer used in the production of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on silicon wafers, and become electronic component products with specific electrical functions. With the development of the size of integrated circuits on semiconductor wafers to the micron level, the cleaning requirements in the semiconductor wafer manufacturing process are getting higher and higher, especially if the semiconductor wafers are polluted by dust particles and metals during the manufacturing process, It is easy to cause damage to the function of the circuit in the chip, form a short circuit or an open circuit, etc., resulting in the failure of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67034
Inventor 陈苏伟吴光庆王勇威刘建民安稳鹏
Owner BEIJING SEMICON EQUIP INST THE 45TH RES INST OF CETC