Method for managing cutting blade and cutting apparatus
A technology of cutting tools and cutting devices, applied in the direction of fine working devices, manufacturing tools, comprehensive factory control, etc., can solve the problem of inability to properly determine the damage of cutting tools, and achieve the effect of proper damage
Active Publication Date: 2019-07-23
DISCO CORP
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- Description
- Claims
- Application Information
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Problems solved by technology
[0005] However, in the cutting tool monitoring unit described above, when chips generated by cutting adhere to the surface of the light emitting unit or the receiving unit, the amount of light incident on the receiving unit may decrease, and it may not be possible to properly determine the breakage of the cutting tool.
Method used
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[0021] An embodiment of one embodiment of the present invention will be described with reference to the drawings. figure 1 It is a perspective view showing a configuration example of the cutting device 2 to which the cutting tool management method of the present embodiment is applied. In addition, in figure 1 In , some structural elements of the cutting device 2 are shown as functional blocks. In addition, the X-axis direction, the Y-axis direction, and the Z-axis direction used in the following description are perpendicular to each other.
[0022] Such as figure 1 As shown, the cutting device 2 has a base 4 that supports each structural element. An opening 4a is formed at a front corner of the base 4, and a cassette elevator 6 that is raised and lowered by a lifting mechanism (not shown) is provided in the opening 4a. A cassette 8 for accommodating a plurality of workpieces 11 is placed on the upper surface of the cassette elevator 6 . In addition, in figure 1 In , for ...
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The invention provides a method for managing a cutting apparatus and the cutting apparatus, which can more properly determine the damage of a cutting tool. The method for managing a cutting tool includes: an initial adjustment step of adjusting an amount of light emitted from a light emitting part by an adjusting part so that a value of an electric signal output from a photoelectric conversion part is equal to or greater than a predetermined value in a full incident state in which light emitted from the light emitting part is incident to a receiving part without being blocked by the cutting tool; a cutting step: after the initial adjustment step is implemented, cutting the processed object by using a cutting tool; and a blade tip position detection step for positioning the movable part atthe open position after the cutting step is performed, bringing the cutting tool close to the tool position detection means, and detecting the position of the blade tip of the cutting tool consumed due to the cutting step; after the movable part is positioned at the open position in the blade tip position detection step, a normal-time readjustment step is performed, and the amount of light emittedfrom the light emitting part is readjusted by the adjustment part.
Description
technical field [0001] The present invention relates to a cutting tool management method for managing cutting tools mounted on a cutting device and a cutting device using the cutting tool management method. Background technique [0002] When processing a plate-shaped workpiece represented by a semiconductor wafer or a package substrate, for example, a cutting device in which a ring-shaped cutting tool is attached to a spindle is used. The workpiece can be cut along the relative movement direction by rotating the spindle to cut the cutting tool into the workpiece, and moving the spindle and the cutting tool relative to the workpiece. [0003] The cutting device as described above is provided with a cutting tool monitoring unit which monitors the state of the cutting tool during cutting of a workpiece (for example, refer to Patent Document 1). The cutting tool monitoring unit includes, for example, a light emitting unit and a receiving unit arranged at positions sandwiching t...
Claims
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Login to View More IPC IPC(8): B28D7/00B28D7/04B28D5/02H01L21/67
CPCB28D5/0058B28D5/0082B28D5/023H01L21/67092Y02P90/30H01L21/78H01L21/67242H01L21/67051
Inventor 田中诚笠井刚史小池彩子
Owner DISCO CORP