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Ultraviolet laser adhesive removal method and system

An ultraviolet laser and laser technology, applied in the field of ultraviolet laser degumming methods and systems, can solve the problems of low degumming accuracy, low degumming efficiency, and non-environmental protection, and achieve high degumming accuracy, environmental protection in the degumming process, and reduced The effect of labor costs

Active Publication Date: 2020-11-06
HANS LASER TECH IND GRP CO LTD
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method and system for UV laser degumming to solve the technical problems of low degumming efficiency, low degumming accuracy, environmental protection, and low yield in the prior art.

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  • Ultraviolet laser adhesive removal method and system
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  • Ultraviolet laser adhesive removal method and system

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Embodiment Construction

[0062] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0063] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0064] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientations...

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Abstract

The invention provides an ultraviolet laser glue removal method and system. The method comprises the steps that the three-dimensional position range and the glue overflowing height of a glue overflowing position of a workpiece are scanned by a three-dimensional camera device; according to overflowing standards, the glue overflowing height and the three-dimensional position range, the area to be removed at the glue overflowing position of the workpiece is determined; the layer height and marking boundary of each marking layer after partition are obtained, and the marking parameters corresponding to each marking layer are determined according to the layer height of each marking layer; according to the marking content and the marking boundary of each marking layer, the corresponding marking path of each marking layer is determined; and after ultraviolet laser equipment operates according to the marking parameters corresponding to the marking layers, overflowing glue in the marking boundaries of the marking layers is removed by ultraviolet lasers emitted by a laser head traveling along the marking paths of the marking layers. The ultraviolet lasers are utilized to remove the overflowing glue, the labor cost is reduced, the glue removal efficiency is promoted, the amount of glue removal is controllable, the glue removal precision is high, and the glue removal process is environmentfriendly.

Description

technical field [0001] The invention belongs to the technical field of glue removal processing, and more specifically relates to an ultraviolet laser glue removal method and system. Background technique [0002] At present, with the development of science and technology, the "sandwich" mobile phone structure is emerging. The "sandwich" mobile phone structure is composed of a display panel, a relatively high-strength metal middle frame, and a glass back cover. Among them, the back cover needs to be bonded to the metal middle frame, and whether the bonding process is perfect determines the appearance, fastening degree, air resistance test, and waterproof functions of the mobile phone. At present, when using glue to bond the back cover and the middle frame, there is a gap between the back cover and the middle frame, and the material specification tolerance will cause the size of the gap to change, which makes it invariable under the same glue amount. At the same time, the amou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/36B23K26/70
CPCB23K26/36B23K26/702
Inventor 黄恒宽彭云贵陈上杭夏岩胡述旭曹洪涛吕启涛高云峰
Owner HANS LASER TECH IND GRP CO LTD
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