Electroless Plating Automatic Liquid Replenishment Method

A liquid replenishment method and chemical plating technology, applied in liquid chemical plating, non-electric variable control, instruments, etc., can solve the problems of inability to accurately detect accurate liquid replenishment, affect luminosity, color, reduce the accuracy of liquid replenishment, etc., and achieve accurate estimation of the reaction The effect of material consumption, accurate detection and rehydration, and reduction of unstable factors
CN110106497BActive Publication Date: 2021-02-02宁波中科纬诚新材料科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
宁波中科纬诚新材料科技有限公司
Publication Date
2021-02-02

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Abstract

The application of the present invention relates to the technical field of surface treatment, and discloses an automatic liquid replenishment method for electroless plating, 1) detecting the pH value of the plating solution through a pH meter, and the pH meter automatically transmits the detected pH value signal to the control electric box; 2) controlling The electrical box sends corresponding control signals to the metering pump according to the pH value signal to control the opening and closing of the metering pump; the control electrical box is preset with a pH initial value for instructing the metering pump to start working and a calculation for calculating the amount of fluid replacement Formula; 3) When the metering pump starts, the two-way metering pump extracts the liquid A for adjusting the pH of the plating solution and the liquid B for adjusting the composition of the plating solution. After the liquid A and the liquid B are preheated respectively, Enter the plating tank from the auxiliary tank. The above automatic liquid replenishment method for electroless plating can realize automatic synchronization of plating, detection and liquid replenishment, and the detection and liquid replenishment are very accurate.
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Description

technical field

[0001] The invention relates to the technical field of surface treatment, in particular to an automatic liquid replenishment method for electroless plating. Background technique

[0002] Electroless plating, also known as electroless plating, is a plating method that reduces metal ions in the plating solution to metal and deposits them on the surface of various materials or parts with the help of a suitable reducing agent without an external current. Compared with electroplating, electroless plating has the characteristics of uniform plating, small pinholes, no need for DC power supply equipment, deposition on non-conductors, and plated parts are not limited by size and shape.

[0003] The deposition rate of electroless plating solution is mainly affected by the operating temperature during plating, the concentration of metal ions in the plating solution, the concentration of reducing agent and the pH of the plating solution. In order to ensure the depositio...

Claims

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