Radio frequency performance test fixture for BGA package product

A technology for testing fixtures and RF performance, which is used in measurement devices, transmitter monitoring, and measurement of electrical variables to achieve the effects of accurate alignment, fast device installation, and stable electrical connections.

Active Publication Date: 2019-08-09
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a device and method for testing the radio frequency performance of BGA packaging products in order to solve the problem of accurate testing of the radio frequency performance of radio frequency BGA packaging products in the millimeter wave band.

Method used

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  • Radio frequency performance test fixture for BGA package product
  • Radio frequency performance test fixture for BGA package product
  • Radio frequency performance test fixture for BGA package product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A BGA packaging product radio frequency performance test fixture, the test fixture includes a test fixture base plate, a pressurization mechanism, a positioning mechanism, a test motherboard and an elastic diaphragm, and the pressurization mechanism, positioning mechanism, test motherboard and elastic diaphragm are all arranged on The same side of the bottom plate of the test fixture; the pressurizing mechanism is set on the bottom plate of the test fixture to pressurize the BGA package product to be tested, the test motherboard is set between the bottom plate of the test fixture and the pressurizing mechanism, and the elastic diaphragm is placed on the test mother BGA pad side of the board; as Figure 6 As shown, when the BGA package product to be tested is not pressurized by the pressurization mechanism, there is a gap between the BGA ball, the elastic diaphragm, and the BGA pad of the test motherboard of the BGA package product, and there is no conduction. After the ...

Embodiment 2

[0056] A BGA packaging product radio frequency performance test fixture, such as Figure 3-5 As shown, it includes the bottom plate of the test fixture, the pressurization mechanism, the positioning mechanism, the test motherboard, the elastic diaphragm and the limit washer.

[0057] The manufacturing process of the elastic diaphragm is as follows:

[0058] (1) Gold-plate the surface of the wire to obtain a conductive wire with coating protection;

[0059] (2) Weave metal wire and fiber wire (insulation, such as polyester) in the warp and weft directions to obtain a two-dimensional unidirectional conductive wire mesh;

[0060] (3) Arrange the wire mesh and the silica gel sheet into several layers according to the interval, and pre-fix them with clamps, and keep the direction of the wires consistent during the arrangement process;

[0061] (4) Heat and pressurize the laminated structure, so that the metal wire and the insulating medium are closely bonded to obtain a unidirect...

Embodiment 3

[0072] This embodiment discloses a jig for testing the radio frequency performance of a BGA package product, comprising the following steps:

[0073] A. Install the positioning mechanism, the limit gasket and the pressurizing mechanism in sequence;

[0074] B. Place the BGA package product to be tested in the positioning mechanism;

[0075] C. Adjust the pressurization mechanism in the direction of pressurization until the elastic diaphragm conducts radio frequency;

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Abstract

The invention discloses a radio frequency performance test fixture for a BGA package product. The test fixture comprises a test fixture bottom plate, a pressurizing mechanism, a positioning mechanism,a test mother board and an elastic diaphragm. The pressurizing mechanism is arranged on the test fixture bottom plate. The test mother board is arranged between the test fixture bottom plate and thepressurizing mechanism. The elastic diaphragm is arranged at the side of a BGA bonding pad of the test mother board. The positioning mechanism is installed between the test mother board and the pressurizing mechanism. After the pressurizing mechanism pressurizes a to-be-tested BGA package product at a certain degree, the two sides of a pressed point of the elastic diaphragm are in conduction and thus a BGA ball and the BGA bonding pad of the test mother board are in contact and are in conduction, thereby realizing radio frequency transmission. The test mother board outputs received parameters.According to the disclosed test fixture, the test function of the millimeter wave transmission performance of the millimeter-wave-band BGA package product can be realized; the frequency test range ofthe radio frequency BGA package product is extended to be over 40 GHz and the test efficiency is improved by more than 50%; and on the basis of the interconnection structure, the repairing replacement efficiency is increased over twice.

Description

technical field [0001] The invention relates to the field of microwave and millimeter wave components and device testing, in particular to a jig for testing radio frequency performance of BGA packaging products. Background technique [0002] In RF product testing, with the realization of miniaturized BGA-packaged RF products, it is necessary to test the RF performance of BGA-packaged RF products in various packages. The key to the RF performance test fixture of BGA package products is the RF interconnection design between the BGA ball and the fixture. At present, the common interconnection methods mainly include: (1) Elastic probe connection form ( figure 1 As shown), the probes are arranged in an array to realize the connection between each BGA ball and the motherboard of the test fixture. The RF transmission path of this connection is longer (the probe size is longer), and the test insertion loss introduced is also relatively large. It is generally used for radio frequenc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/04H04B17/00H04B17/15H04B17/29
CPCG01R1/0425H04B17/00H04B17/15H04B17/29
Inventor 笪余生廖翱张童童吕英飞刘志辉
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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