Pressure sensor packaging structure and packaging method thereof
A pressure sensor and packaging structure technology, applied in the field of pressure measurement, can solve the problems of seal failure, contact circuit, test medium entering the inner cavity of the shell, etc., and achieve the effect of complete sealing
Pending Publication Date: 2019-08-16
江西新力传感科技有限公司
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Problems solved by technology
However, since the O-ring is in contact with the medium to be tested, under the condition of corrosion of the test medium and the aging of the O-ring itself, it is easy to cause sealing failure, resulting in the test medium entering the inner cavity of the housing and contacting the circuit
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[0025] The pressure sensor packaging structure of this embodiment, such as figure 1 and figure 2 As shown, it includes a housing 1 , a circuit board disposed in the housing cavity 13 of the housing 1 and a pressure sensitive chip, the pressure sensitive chip is a MEMS pressure sensitive chip. The housing 1 includes a housing cover 12, a connector 7 that is closed and connected to one side of the housing cover 12 and used for external electrical connection, and a base 8 that is closed and connected to the other side of the housing cover 12. The housing cavity 13 is formed on the connector 7, the housing The inner space enclosed between the body cover 12 and the base 8 . The base 8 is provided with a channel 2 through the center, and the outer surface of the base 8 is threaded (used to connect the external pipe for circulating the measuring medium), so one end of the channel 2 can communicate with the measuring medium.
[0026] like image 3 As shown, the circuit board inclu...
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The invention relates to a pressure sensor packaging structure and a packaging method thereof, and belongs to the technical field of pressure measurement. The structure comprises a shell, a circuit board and a pressure sensitive chip, wherein the circuit board and the pressure sensitive chip are arranged in a shell cavity; the circuit board comprises a ceramic circuit board and a PCB; according tothe packaging, the periphery of the pressure sensitive chip is coated with a colloid; a substrate is welded on the end surface of the other end of a pore channel communicated with a shell base in a sealing mode; the ceramic circuit board is arranged on the surface of one side of the substrate and is positioned in the pore channel; the PCB is attached to the surface of the other side of the substrate and located in the shell cavity; the PCB is electrically connected with a connector; the pressure sensitive chip is inversely welded on the surface of one side of the ceramic circuit board; and the ceramic circuit board, the substrate and the PCB circuit board are stacked in sequence, and terminal columns run through the two ends of the through hole to be welded with the ceramic circuit boardand the PCB in a sealing mode respectively. Therefore, an integral isolation sealing structure of a test cavity isolated from the shell cavity can be formed, so that the sealing problem between a measurement medium and a circuit device can be better solved.
Description
technical field [0001] The invention relates to a packaging structure of a pressure sensor and a packaging method thereof, belonging to the technical field of pressure measurement. Background technique [0002] The pressure sensor senses the pressure signal through the pressure sensitive unit, and can convert the pressure signal into an available output electrical signal according to certain rules, and then processed by the signal processing unit into the corresponding analog output or digital output form. Commonly used pressure sensor pressure sensitive units include the following technologies, ceramic capacitors / ceramic resistors / glass micro-melting / sputtering thin films / micro-electromechanical systems (MEMS). For the use environment of the sensor, the sensor needs to be compatible with complex media environments such as water / oil / compressed air / natural gas / refrigerant, and has strict sealing requirements. [0003] From the packaging form of the sensor, ceramic capacitors...
Claims
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IPC IPC(8): G01L1/18
CPCG01L1/18
Inventor 费友健娄帅刘召利
Owner 江西新力传感科技有限公司