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Photosensitive Polyimide Composition and Photoresist Film MADE Thereof

A technology of polyimide and polyimide resin, which is applied in the field of photosensitive resin composition and can solve the problems of non-chemical resistance and damage

Active Publication Date: 2019-08-16
ECHEM SOLUTIONS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, traditional polyimide resins are not chemically resistant, so when used as an insulating layer in semiconductor manufacturing, they are often damaged by the acid / alkali environment in subsequent processes

Method used

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  • Photosensitive Polyimide Composition and Photoresist Film MADE Thereof
  • Photosensitive Polyimide Composition and Photoresist Film MADE Thereof
  • Photosensitive Polyimide Composition and Photoresist Film MADE Thereof

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Embodiment Construction

[0015] The photosensitive polyimide composition provided by the present invention is a positive-type photosensitive resin composition, mainly comprising polyimide resin, quinone azide sulfonate as a photosensitive agent, thermosetting agent, and thermal acid generator. The composition with such a composition not only has heat resistance but also good chemical resistance after hard-baking, and can better meet the manufacturing requirements of the insulating layer required by special specifications.

[0016] The polyimide resin used in the present invention preferably has a structural unit represented by formula (1) and a structural unit represented by formula (2).

[0017]

[0018] In formula (1) and (2), n is the integer of 10-600, and aforementioned polyimide resin molecular weight scope is between 5000-50000, Ar 1 is a tetravalent organic group, Ar 2 For two to four valent organic groups; Ar 3 is a divalent aryl group, R 1 It is an OH group or a COOH group.

[0019] ...

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Abstract

A photosensitive polyimide composition provided comprises a polyimide resin, a quinone azide sulfonate, and a thermal hardener, and thermal acid generator, having a structural unit represented by theformula (1) and a structural unit represented by the formula (2). In the formulas (1) and (2), n is an integer of 10 to 600, Ar<1> is a tetravalent organic group; Ar<2> is a divalent to tetravalent organic group; Ar<3> is a divalent aromatic group; and R<1> is an OH group or a COOH group. The present invention also provides a photoresist film made of the above-mentioned photosensitive polyimide composition.

Description

technical field [0001] The present invention relates to a photosensitive resin composition, in particular to a photosensitive polyimide (PSPI) composition which can be used to make an insulating layer or a protective layer in a semiconductor device. Background technique [0002] Photosensitive polyimide resin has heat resistance, excellent mechanical properties, and excellent dimensional stability, and is often used in the field of heat-resistant coating materials, interlayer insulating materials for printed circuit boards, and insulating materials for semiconductors. Material. However, traditional polyimide resins do not have chemical resistance, so when they are used as insulating layers in semiconductor manufacturing processes, they are often damaged by the acid / alkali environment in subsequent processes. Contents of the invention [0003] The present invention improves the disadvantages of the aforementioned polyimide resin, and provides a photosensitive resin composi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/004G03F7/039
CPCG03F7/004G03F7/039G03F7/0233G03F7/0226G03F7/0757C08G73/1046G03F7/0045G03F7/16G03F7/168G03F7/20G03F7/26G03F7/38C08G73/1042C08G73/105C08G73/1017C08G73/1039C08G73/106C08G73/1075C09D179/08
Inventor 杨子瑾钟明哲
Owner ECHEM SOLUTIONS