LED light source substrate

Abstract

The invention discloses an LED light source substrate. The LED light source substrate comprises a cutting box, wherein a pressing cavity is arranged in the cutting box, a pressing mechanism is arranged in the pressing cavity and comprises a pressing block, a pressing rack is fixedly installed on the pressing block, a main rack check block is fixedly installed on the pressing rack, a conveying outlet is arranged on the right side of the pressing cavity, and a conveying cavity is arranged below the conveying outlet; a cutting blade in a cutting mechanism cuts the substrate and stays on the pressing block through the pressing cavity, the cut substrate bodies can be stacked, the substrate bodies use the gravity to make the pressing block move downward, an eccentric wheel is driven through transmission to rotate to push a pushing sliding block to move rightward, the stacked substrate bodies are pushed by the pushing sliding block to the conveying outlet and are transported out through a conveying belt, a check block mechanism makes uses of a stop lever to close the pressing cavity when the substrate bodies are stacked to a certain amount, and the stacking amount of the substrate bodiesis controlled.

Description

technical field [0001] The invention relates to the technical field of substrate processing, in particular to an LED light source substrate. Background technique [0002] The LED light source is a light emitting diode light source. This kind of light source has the advantages of small size, long life and high efficiency, and can be used continuously for up to 100,000 hours. In the future, the application of LED light sources in the field of lighting will also become the mainstream, and the production materials of LED light sources are mostly substrates; [0003] After the substrate is produced, it needs to be cut before it can be packaged and used. In the existing technology, the general substrate cutting equipment only has the function of cutting, resulting in a single function of the equipment and a large number of processing devices. During the cutting process, only one piece of equipment can be transported. The cut substrates cannot be stacked and transported together, ...

AI Technical Summary

Problems solved by technology

[0003] After the substrate is produced, it needs to be cut before it can be packaged and used. In the existing technology, the general substrate cutting equipment only has the function of cutting, resulting in a single function of the equipment and a large number of processing devices. During the cutting process, only one piece of equipment can be transported. The cut substrates cannot be stacked and transported together, which makes it difficult to handle the cut substrates and requires a lot of labor. Therefore, a method that can not only cut, but also transport, and can stack the cut substrates is needed. Up, and according to a certain amount of LED light source substrate equipment

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