Packaging equipment for chip packaging

Abstract

The invention relates to the technical field of chip production, and discloses packaging equipment for chip packaging. The packaging equipment for chip packaging comprises a supporting bottom plate, the top of the supporting bottom plate is fixedly provided with a connecting supporting block, the top of the connecting supporting block is fixedly provided with a positioning side plate, one side ofthe positioning side plate is movably connected with a pressurizing rod, one end of the pressurizing rod penetrates through and extends to the other side of the positioning side plate, and one end ofthe pressurizing rod is fixedly provided with a limiting baffle. According to the packaging equipment for chip packaging, a transmission motor operates, the left output end of the transmission motor drives a transmission gear to rotate, then the transmission gear is engaged with a transmission conveyor belt to rotate, and when a chip operates through the conveyor belt, the limiting baffle is flexibly pressurized through the pressurizing rod and a flexible spring, so that the chip is flexibly limited through the limiting baffle, the defect that the chip deviates from an industrial transportation channel is avoided, and the effect of stable packaging quality of the track positioning chip can be achieved.

Description

technical field [0001] The invention relates to the technical field of chip production, in particular to a packaging device for chip packaging. Background technique [0002] Chip is the general term for semiconductor component products. It is the carrier of integrated circuits. It is divided into wafers. It is integrated circuits. It generally refers to all electronic components. The circuit module, which is the most important part of electronic equipment, undertakes the functions of calculation and storage. The application range of integrated circuits covers almost all electronic equipment for military and civilian use. [0003] After the chip is produced, most of it needs to be packaged and sealed to effectively protect the chip itself. Most of the existing packaging equipment in the production of chip packaging and track conveying equipment in the packaging of the chip do not use a limit structure, which is easy It causes the chip to deviate from the industrial transport...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a packaging device for chip packaging, which has the advantages of track positioning and stable chip packaging quality, and solves the problem that most of the existing packaging equipment does not use a limit structure, which easily causes the chip to deviate from the industrial transport track problem

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