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suction device

A suction device and suction tube technology are applied in the field of suction devices and devices for removing air bubbles in electroplating baths, and can solve the problems of reduced wafer surface current, electroplating defects, and increased area resistance.

Active Publication Date: 2020-09-22
淮安西德工业设计有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the modern electroplating process, there is still a certain degree of terminal effect, and the uniformity of the metal film still needs to be further improved
Although the high resistance virtual anode (HRVA) can be used to reduce the terminal effect, due to the influence of factors such as the stirring of the plating solution and the liquid circulation environment, bubbles will accumulate under the high resistance virtual anode in the electroplating tank, and the existence of bubbles will increase Large area resistance, resulting in reduced wafer surface current, which in turn leads to defective plating of the product

Method used

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Embodiment Construction

[0034] The specific implementation manners of the present application will be further described in detail below in conjunction with the drawings and embodiments. The following examples are used to illustrate the present application, but not to limit the scope of the present application.

[0035] Exemplary implementations of the present application will be described below with reference to the accompanying drawings. In the interest of clarity and conciseness, not all features of an actual implementation are described in this specification. Here, it should also be noted that, in order to avoid obscuring the application due to unnecessary details, only the device structure and / or processing steps closely related to the solution according to the application are shown in the drawings, and the Other details that are not relevant to this application are included.

[0036] figure 1 is a schematic diagram of the wafer metal plating setup. The metal plating apparatus may include a p...

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Abstract

The invention discloses a suction device. The suction device comprises a suction component and a rotary shaft, wherein the suction component comprises a plurality of suction ports, and the suction ports are distributed at the bottom of the suction component; the first end of the rotary shaft is fixedly connected to the top of the suction component; the multiple suction ports are located in the positions perpendicular to the rotary shaft. Through the suction device, bubbles existing below a high-resistance virtual anode can be effectively removed from an electroplating solution, and the defectrate of electroplated wafers can be reduced.

Description

technical field [0001] The present application relates to the field of semiconductor manufacturing, in particular to a suction device, and more specifically to a device for removing air bubbles in an electroplating tank. Background technique [0002] In semiconductor manufacturing, metals are typically deposited onto wafers by an electroplating process. However, in the modern electroplating process, there is still a certain degree of terminal effect, and the uniformity of the metal film still needs to be further improved. Although the high resistance virtual anode (HRVA) can be used to reduce the terminal effect, due to the influence of factors such as the stirring of the plating solution and the liquid circulation environment, bubbles will accumulate under the high resistance virtual anode in the electroplating tank, and the existence of bubbles will increase Large area resistance, which leads to a decrease in wafer surface current, which in turn leads to defects in the pl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D21/04C25D17/00
CPCC25D17/00C25D21/04
Inventor 王金岗薛超林宗贤
Owner 淮安西德工业设计有限公司