LED chip and its preparation method, display module, intelligent terminal
A technology of LED chips and functional layers, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as inability to detect PL of microLED chips
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0092] The preparation method of the substrate 100 includes adopting a crystal growth process to prepare sapphire (aluminum oxide (Al 2 o 3 )) crystal column. Then slice and polish the crystal column to obtain the above-mentioned substrate 100 . For example, the thickness of the substrate 100 may be about 2 Inch.
[0093] In addition, the main epitaxial layer 110 of the main device 60, in addition to the first semiconductor layer 111, the second semiconductor layer 112 and the first light emitting layer 113, also includes Figure 6a The shown semiconductor nucleation layer 114, non-doped semiconductor layer 115, low-doped semiconductor layer 116, superlattice layer 117, electron blocking layer 118, ohmic contact layer 119 and distributed Bragg reflection layer (distributed brag reflection, DBR )120.
[0094] Based on this, the manufacturing method of the main device 60 includes: first, in such as Figure 6a On the upper surface of the substrate 100 is shown, a semiconduct...
example 1
[0140] In this example, the above-mentioned S102 manufacturing the antenna structure 40 includes making a plurality of antenna structures 40 insulated from the main epitaxial layer 110 on the outside of the main epitaxial layer 110, such as Figure 11a The conductive coil 400 is shown.
[0141] Both ends of each conductive coil 400 are respectively in contact with the first electrode 121 and the second electrode 122 located in the same building area 30, and at least a part of each conductive coil 400 is located at the cut between two adjacent building areas 30 Inside Road 31.
[0142] In some embodiments of the present application, such as Figure 11a As shown, the above-mentioned first electrode 121 (or second electrode 122 ) may be located in the conductive coil 400 . In addition, any two coil turns in the conductive coil 400 do not intersect, that is, there is no overlapping area in the orthographic projection of each part of the conductive coil 400 on the main epitaxial ...
example 2
[0186] In this example, above-mentioned S102 manufactures the antenna structure 40 including as Figure 16a As shown, on the outside of the main epitaxial layer 110 , a plurality of conductive coils 400 are fabricated, and each conductive coil 400 is located in a building area 30 .
[0187] In this example, the two ends of each conductive coil 400 are referred to as a first end and a second end. Wherein, the first end of the conductive coil 400 faces the first electrode 121 , and the second end of the conductive coil 400 faces the second electrode 122 .
[0188] In this case, in order to couple the first end of the conductive coil 400 to the first electrode 121 and the second end to the second electrode 122, a connection between the first end of each conductive coil 400 and the first electrode 121 is formed. The second end of the capacitor is in contact with the second electrode 122 .
[0189] Alternatively, a capacitance is formed between the first end of each conductive co...
PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More