Micro-electronic rotary self-binding air core inductance winding shaft

Abstract

The invention relates to the technical field of inductance winding, and discloses a micro-electronic rotary self-binding air core inductance winding shaft, which comprises a box body, wherein a gear mechanism is rotationally connected to the interior of the box body; a rotating shaft is meshed with the center of the surface of the gear mechanism through a bearing; a winding groove is arranged in the surface of the rotating shaft; an air bag clamping device is movably arranged at the lower end of the gear mechanism; the lower part of the air bag clamping device is fixedly connected to a wire inlet device; the air bag clamping device comprises a clamping rod; a containing groove is arranged in the clamping rod; the interior of the containing groove is movably connected to a binding belt; thelower part of the clamping rod is fixedly connected to a connecting rod; an air bag is movably arranged at one end, far away from the clamping rod, of the connecting rod; vent pipes are fixedly connected to the two sides of the air bag; one end, far away from the air bag, of each vent pipe is fixedly connected to the clamping rod; and when winding is needed, a driving component is started, so that a screw rod rotates to drive the gear mechanism to rotate, and a driven wheel performs circular motion on the surface of a driving wheel and drives the rotating shaft to rotate.

Description

technical field [0001] The invention relates to the technical field of inductance wire winding, in particular to a microelectronic rotary self-bundling hollow inductance winding shaft. Background technique [0002] In recent years, with the development of miniaturization and miniaturization of products, the rapid development of the microelectronics industry has been driven. Microelectronics technology is the core technology of high-tech and information industries. Microelectronics technology is a new technology developed along with integrated circuits, especially ultra-large-scale integrated circuits. Microelectronics industry is a basic industry. The reason why it develops It is so fast, in addition to the great contribution of the technology itself to the national economy, it is also related to its strong permeability. The diameter of the miniature hollow inductor is as thin as one-fifth of a hair, and the inner diameter of the coil is 0.4mm. 8 circles, the main part of t...

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Problems solved by technology

Microelectronics technology is the core technology of high-tech and information industries. Microelectronics technology is a new technology developed along with integrated circuits, especially ultra-large-scale integrated circuits. Microelectronics industry is a basic industry. The reason why it develops It is so fast, in addition to the great contribution of the technology itself to the national economy, it is also related to its strong permeability. The diameter of the miniature hollow inductor is as thin as one-fifth of a hair, and the inner diameter of the coil is 0.4mm. 8 circles, the main part of the whole product is similar in size to a sphere with a diameter of 0.3mm. The processing of the inductance wire generally includes making the core, wrapping, installing the connector, etc. In the prior art, in order to facilitate the transportation and packaging of electronic products, its supporting The inductance wires need to be wound after the production is completed. The winding device in the prior art can only wind one inductance wire at a time, and after the inductance wires are wound, the inductance wires need to be bundled manually, resulting in low processing efficiency.

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