Hybrid touch module

A touch module and hybrid technology, applied in instruments, computing, electrical and digital data processing, etc., can solve the problems of thick product thickness, high material cost, and high restrictions, and achieve reduced thickness and material cost, wide operating conditions, The effect of preventing accidental touch

Active Publication Date: 2019-09-20
HIGGSTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the resistive touch module performs touch operation by pressing, which has less restrictions on operating conditions, but it is worse than the capacitive touch module in terms of smoothness of induction (especially for those who need to write frequently and for drawing users)
Although the capacitive touch module is better in terms of smoothness of sensing, there are operating conditions that cannot be worn with gloves
Furthermore, both the r

Method used

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Example

[0026] [First Embodiment]

[0027] Such as figure 1 , figure 2 and Figure 4 , Which is the first embodiment of the present invention. This embodiment discloses a hybrid touch module 100, which can be used to provide a resistive touch function and a capacitive touch function, and the hybrid touch module 100 can be applied to smart phones, tablet computers, On electronic products such as laptops or industrial computers. The hybrid touch module 100 includes a bottom structure 1, a common layer structure 2 disposed on the bottom structure 1, a top layer structure 3 attached to the common layer structure 2, and A protection structure 4 on the top structure 3 is described. Furthermore, the hybrid touch module 100 further includes a common controller 5 (such as a common controller) electrically connected to the bottom structure 1, the common layer structure 2, and the top structure 3 Figure 4 ). The specific structure of each component of the hybrid touch module 100 of this embodi...

Example

[0045] [Second Embodiment]

[0046] Such as image 3 , Which is the second embodiment of the present invention. This embodiment discloses a hybrid touch module 100, which includes a bottom structure 1, a shared layer structure 2, a top layer structure 3, a protection structure 4, and a shared controller 5. The structural design and positional configuration relationship of the underlying structure 1, the protection structure 4, and the shared controller 5 of this embodiment are substantially the same as those of the first embodiment. The difference lies in the structural design and location configuration of the shared layer structure 2 and the top structure 3. The following will describe the differences between this embodiment and the first embodiment.

[0047] The conductive layer 23 for the capacitor of the common layer structure 2 of this embodiment is disposed on the second surface 212 of the common film 21, and the electrode layer 32 of the top layer structure 3 is disposed o...

Example

[0050] [Third Embodiment]

[0051] Such as Figure 5 and Image 6 , Which is the third embodiment of the present invention. This embodiment discloses a hybrid touch module 100, which includes an underlying structure 1, a shared layer structure 2, a protection structure 4, and a shared controller 5. The structural design of each component of this embodiment is roughly the same as that of the second embodiment. The biggest difference between this embodiment and the second embodiment is that the hybrid touch module 100 of this embodiment does not have the top layer structure 3. The following will describe the differences between this embodiment and the first embodiment.

[0052] Since the hybrid touch module 100 of this embodiment does not have the top layer structure 3, the hybrid touch module 100 of this embodiment uses the capacitive conductive layer 23 and the common film 21 of the shared layer structure 2 to provide a capacitive touch. Control function. In other words, the sh...

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Abstract

The invention discloses a hybrid touch module. The module comprises a bottom layer structure, a common layer structure and a top layer structure, wherein the bottom layer structure comprises a substrate, a conductive layer arranged on the substrate and a frame arranged on the conductive layer; the common layer structure is arranged on the frame and is spaced from the conductive layer; wherein the common layer structure comprises a common film, a resistance conductive layer and a capacitance conductive layer, the common film is provided with a first surface and a second surface, the resistance conductive layer is arranged on the first surface of the common film, and the capacitance conductive layer is arranged on one of the first surface and the second surface of the common film; the top layer structure is attached to the common layer structure, the top layer structure comprises an insulating film and an electrode layer arranged on the insulating film, the common layer structure can be matched with the bottom layer structure to provide a resistance type touch control function, and the common layer structure can be matched with the top layer structure to provide a capacitance type touch control function. The hybrid touch module disclosed by the invention can simultaneously provide a resistance type touch function and a capacitance type touch function.

Description

technical field [0001] The invention relates to a touch module, in particular to a hybrid touch module with resistive touch function and capacitive touch function. Background technique [0002] Existing touch modules include resistive touch modules and capacitive touch modules. Among them, the resistive touch module performs touch operation by pressing, which has less restrictions on operating conditions, but it is worse than the capacitive touch module in terms of smoothness of induction (especially for those who need to write frequently and for drawing users). Although the capacitive touch module is better in the smoothness of sensing, it has the limitation of operating conditions that cannot be worn with gloves. Furthermore, no matter the resistive touch module or the capacitive touch module, there is a defect that the user is easy to touch by mistake. [0003] In addition, if the resistive touch module and the capacitive touch module are only combined in a general way...

Claims

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Application Information

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IPC IPC(8): G06F3/044G06F3/045
CPCG06F3/045G06F3/044
Inventor 蔡宏育蔡菖佑
Owner HIGGSTEC
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