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Hybrid touch module

A touch module and hybrid technology, applied in instruments, computing, electrical and digital data processing, etc., can solve the problems of thick product thickness, high material cost, and high restrictions, and achieve reduced thickness and material cost, wide operating conditions, The effect of preventing accidental touch

Active Publication Date: 2019-09-20
HIGGSTEC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Among them, the resistive touch module performs touch operation by pressing, which has less restrictions on operating conditions, but it is worse than the capacitive touch module in terms of smoothness of induction (especially for those who need to write frequently and for drawing users)
Although the capacitive touch module is better in terms of smoothness of sensing, there are operating conditions that cannot be worn with gloves
Furthermore, both the resistive touch module and the capacitive touch module have defects that make it easy for users to accidentally touch
[0003] In addition, if the resistive touch module and the capacitive touch module are only combined in a common way (such as bonding), so that the touch module has both the resistive touch function and the capacitive touch function, It may lead to defects such as excessive thickness of the product, poor integration, and high material cost

Method used

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Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0027] Such as figure 1 , figure 2 and Figure 4 , which is the first embodiment of the present invention. This embodiment discloses a hybrid touch module 100, which can be used to provide a resistive touch function and a capacitive touch function, and the hybrid touch module 100 can be applied to smart phones, tablet computers, Laptops, or industrial computers and other electronic products. The hybrid touch module 100 includes a bottom structure 1, a shared layer structure 2 disposed on the bottom structure 1, a top layer structure 3 attached to the shared layer structure 2, and a top layer structure attached to the shared layer structure 2. A protective structure 4 on the top structure 3. Furthermore, the hybrid touch module 100 further includes a shared controller 5 (such as Figure 4 ). The specific structure of each component of the hybrid touch module 100 in this embodiment will be described below, and then the connection relationship between each component of the...

no. 2 example

[0046] Such as image 3 , which is the second embodiment of the present invention. This embodiment discloses a hybrid touch module 100 , which includes a bottom layer structure 1 , a shared layer structure 2 , a top layer structure 3 , a protection structure 4 , and a shared controller 5 . The structural design and location arrangement relationship of the underlying structure 1 , the protection structure 4 , and the common controller 5 in this embodiment are substantially the same as those in the first embodiment. The difference lies in the structural design and position arrangement of the common layer structure 2 and the top layer structure 3 . The difference between this embodiment and the first embodiment will be described below.

[0047] The capacitor conductive layer 23 of the common layer structure 2 of this embodiment is disposed on the second surface 212 of the common film 21 , and the electrode layer 32 of the top layer structure 3 is disposed on the top surface 312...

no. 3 example

[0051] Such as Figure 5 and Figure 6 , which is the third embodiment of the present invention. This embodiment discloses a hybrid touch module 100 , which includes a bottom layer structure 1 , a shared layer structure 2 , a protection structure 4 , and a shared controller 5 . The structural design of each component of this embodiment is substantially the same as that of the second embodiment. The biggest difference between this embodiment and the second embodiment is that the hybrid touch module 100 of this embodiment does not have the top structure 3 . The difference between this embodiment and the first embodiment will be described below.

[0052] Since the hybrid touch module 100 of this embodiment does not have a top layer structure 3, the hybrid touch module 100 of this embodiment provides a capacitive touch sensor by sharing the capacitive conductive layer 23 and the common film 21 of the layer structure 2. control function. That is to say, the common layer struct...

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Abstract

The invention discloses a hybrid touch module. The module comprises a bottom layer structure, a common layer structure and a top layer structure, wherein the bottom layer structure comprises a substrate, a conductive layer arranged on the substrate and a frame arranged on the conductive layer; the common layer structure is arranged on the frame and is spaced from the conductive layer; wherein the common layer structure comprises a common film, a resistance conductive layer and a capacitance conductive layer, the common film is provided with a first surface and a second surface, the resistance conductive layer is arranged on the first surface of the common film, and the capacitance conductive layer is arranged on one of the first surface and the second surface of the common film; the top layer structure is attached to the common layer structure, the top layer structure comprises an insulating film and an electrode layer arranged on the insulating film, the common layer structure can be matched with the bottom layer structure to provide a resistance type touch control function, and the common layer structure can be matched with the top layer structure to provide a capacitance type touch control function. The hybrid touch module disclosed by the invention can simultaneously provide a resistance type touch function and a capacitance type touch function.

Description

technical field [0001] The invention relates to a touch module, in particular to a hybrid touch module with resistive touch function and capacitive touch function. Background technique [0002] Existing touch modules include resistive touch modules and capacitive touch modules. Among them, the resistive touch module performs touch operation by pressing, which has less restrictions on operating conditions, but it is worse than the capacitive touch module in terms of smoothness of induction (especially for those who need to write frequently and for drawing users). Although the capacitive touch module is better in the smoothness of sensing, it has the limitation of operating conditions that cannot be worn with gloves. Furthermore, no matter the resistive touch module or the capacitive touch module, there is a defect that the user is easy to touch by mistake. [0003] In addition, if the resistive touch module and the capacitive touch module are only combined in a general way...

Claims

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Application Information

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IPC IPC(8): G06F3/044G06F3/045
CPCG06F3/045G06F3/044
Inventor 蔡宏育蔡菖佑
Owner HIGGSTEC
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