Flexible circuit board and manufacturing method thereof
A flexible circuit board and manufacturing method technology, applied in the direction of printed circuit manufacturing, laminated printed circuit board, printed circuit, etc., can solve problems such as affecting product quality, unable to guarantee the resistance value of conductive adhesive, etc. Effect
Inactive Publication Date: 2019-09-20
SHENZHEN XINYU TENGYUE ELECTRONICS
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a flexible circuit board and its manufacturing method, so as to solve the problem that the existing flexible circuit board produces indentations during the production and lamination process, which cannot guarantee the resistance value of the conductive adhesive and affects the product quality.
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[0021] The conception, specific structure and technical effects of the present invention are clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments in the present application and the features in the embodiments can be combined without conflict. In addition, the descriptions such as up, down, left, and right used in the present invention are only relative to the positional relationship of the various components of the present invention in the drawings.
[0022] figure 1 It is a schematic diagram of the top surface of an embodiment of the flexible circuit board of the present invention, figure 2 It is a schematic diagram of the bottom surface of an embodiment of the flexible circuit board of the present invention, refer to figure 1 and figure 2 , the flexible circuit board includes a reinforcement 10 and a ...
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The invention discloses a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises reinforcements and a circuit board body, wherein the reinforcements are composed of a first reinforcement, a second reinforcement, a third reinforcement, a fourth reinforcement and a fifth reinforcement; the first reinforcement and the second reinforcement are arranged on the top of the circuit board body; the third reinforcement, the fourth reinforcement and the fifth reinforcement are arranged on the bottom of the circuit board body; the first reinforcement, the second reinforcement, the third reinforcement, the fourth reinforcement and the fifth reinforcement are staggered. The manufacturing method comprises the following steps: affixing the third reinforcement, the fourth reinforcement and the fifth reinforcement on the circuit board body; pre-baking the circuit board body with the third reinforcement, the fourth reinforcement and the fifth reinforcement; performing vacuum compression; affixing the first reinforcement and the second reinforcement; pressing the first reinforcement and the second reinforcement affixed on the circuit board; and waiting for curing. Thus, such a manufacturing method can prepare the flexible circuit board without indentation and can ensure the resistance value of a conductive adhesive during pressing.
Description
technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] Reinforcing steel sheets are usually installed on flexible circuit boards. Existing flexible circuit boards are provided with reinforcing steel sheets on the front and back sides. Unavoidable indentations will appear when the circuit board and steel sheets are pressed together, which will seriously affect the quality of the product. Moreover, the resistance value of the conductive adhesive cannot be guaranteed during the lamination process. [0003] Therefore, a flexible circuit board with a new structure and a manufacturing method thereof are needed to solve the above-mentioned problems. Contents of the invention [0004] The technical problem to be solved by the present invention is: to provide a flexible circuit board and its manufacturing method, so as to solve the pr...
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IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0281H05K3/0058H05K2201/2009
Inventor 李志军李伟丰张永斌杨仕德胥海兵史继红吕剑刘扬吕柏平郑绍东潘辉欧阳政
Owner SHENZHEN XINYU TENGYUE ELECTRONICS