Flexible circuit board and manufacturing method thereof

Abstract

The invention discloses a flexible circuit board and a manufacturing method thereof. The flexible circuit board comprises reinforcements and a circuit board body, wherein the reinforcements are composed of a first reinforcement, a second reinforcement, a third reinforcement, a fourth reinforcement and a fifth reinforcement; the first reinforcement and the second reinforcement are arranged on the top of the circuit board body; the third reinforcement, the fourth reinforcement and the fifth reinforcement are arranged on the bottom of the circuit board body; the first reinforcement, the second reinforcement, the third reinforcement, the fourth reinforcement and the fifth reinforcement are staggered. The manufacturing method comprises the following steps: affixing the third reinforcement, the fourth reinforcement and the fifth reinforcement on the circuit board body; pre-baking the circuit board body with the third reinforcement, the fourth reinforcement and the fifth reinforcement; performing vacuum compression; affixing the first reinforcement and the second reinforcement; pressing the first reinforcement and the second reinforcement affixed on the circuit board; and waiting for curing. Thus, such a manufacturing method can prepare the flexible circuit board without indentation and can ensure the resistance value of a conductive adhesive during pressing.

Description

technical field [0001] The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board and a manufacturing method thereof. Background technique [0002] Reinforcing steel sheets are usually installed on flexible circuit boards. Existing flexible circuit boards are provided with reinforcing steel sheets on the front and back sides. Unavoidable indentations will appear when the circuit board and steel sheets are pressed together, which will seriously affect the quality of the product. Moreover, the resistance value of the conductive adhesive cannot be guaranteed during the lamination process. [0003] Therefore, a flexible circuit board with a new structure and a manufacturing method thereof are needed to solve the above-mentioned problems. Contents of the invention [0004] The technical problem to be solved by the present invention is: to provide a flexible circuit board and its manufacturing method, so as to solve the pr...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to provide a flexible circuit board and its manufacturing method, so as to solve the problem that the existing flexible circuit board produces indentations during the production and lamination process, which cannot guarantee the resistance value of the conductive adhesive and affects the product quality.

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