Production process and structure for FPC
A production process and reinforcement technology, applied in the secondary processing of printed circuits, printed circuit components, circuit bendable/stretchable components, etc., to achieve reliable connections
Pending Publication Date: 2019-09-20
SHENZHEN XINYU TENGYUE ELECTRONICS
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Problems solved by technology
[0004] The technical problem to be solved by the present invention is to provide a FPC production process and structure, thereby solving the problem of connection between the reinforcement and the FPC body
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[0020] The conception, specific structure and technical effects of the present invention are clearly and completely described below in conjunction with the embodiments and accompanying drawings, so as to fully understand the purpose, scheme and effect of the present invention. It should be noted that the embodiments in the present application and the features in the embodiments can be combined without conflict. In addition, the descriptions such as up, down, left, and right used in the present invention are only relative to the positional relationship of the various components of the present invention in the drawings.
[0021] figure 1 For the flow chart of FPC production technique of the present invention, refer to figure 1 , a FPC production process, mainly includes the following steps, the reinforcement and the IC are attached to the FPC body by SMT brushing tin, and the reinforcement protects the IC; after that, another reinforcement is laminated to the FPC with a reflow ...
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The invention discloses a production process for an FPC. The production process mainly comprises the following steps: attaching a reinforcement and an IC to an FPC body via a tin coat by using SMT; allowing the FPC body to pass through a reflow furnace; laminating another reinforcement onto both the IC and the reinforcement with the IC; pressing the reinforcement and the FPC body by using a fast pressure machine; and curing the FPC. An FPC structure comprises the FPC body; the upper part of the FPC body is provided with tin paste at intervals; the upper part of the tin paste is provided with the IC and / or the reinforcement; the upper part of the IC is coated with a glue solution; the upper part of the glue solution is connected with the another reinforcement; and the another reinforcement is connected with the IC and / or the reinforcement by glue. The FPC structure with reliable connection between the reinforcement and the FPC body is formed by setting the FPC body, arranging the tin paste on the upper part of the FPC body at intervals, arranging the IC and / or the reinforcement on the upper part of the tin paste, coating the reinforcement and / or the IC with the glue solution, connecting the upper part of the glue solution with the another reinforcement and connecting the another reinforcement with the IC and / or the reinforcement via glue.
Description
technical field [0001] The technical proposal relates to the technical field of flexible circuit board production, specifically a FPC production process and structure. Background technique [0002] In the general FPC production process, when pasting steel sheets for reinforcement, it is necessary to perform SMT welding of IC components first, and then pass another process for pasting steel sheets for reinforcement, and then bake the board for curing. The FPC produced by this production method has a small peel strength between the reinforcement and the FPC body, and the reinforcement is easy to fall off from the FPC body, resulting in poor reliability and low efficiency of the FPC product. [0003] Therefore, a novel FPC production process and FPC structure are needed to solve the above problems. Contents of the invention [0004] The technical problem to be solved by the present invention is to provide a FPC production process and structure, so as to solve the problem of ...
Claims
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IPC IPC(8): H05K3/22H05K1/02
CPCH05K3/22H05K1/0281
Inventor 刘扬杨仕德胥海兵史继红吕剑李志军吕柏平郑绍东潘辉欧阳政
Owner SHENZHEN XINYU TENGYUE ELECTRONICS